Semiconductor manufacturing apparatus and method of manufacturing semiconductor device

Abstract

According to one embodiment, in a semiconductor manufacturing apparatus, a controller relatively moves a bonding tool and a stage close to each other while causing a semiconductor chip to adhere by suction to a surface via a tape using at least a first suction structure in a first period. In a second period, the controller controls the temperature of the bonding tool to a first target temperature while keeping substantially equal to a target pressure a pressure applied to the semiconductor chip by the bonding tool. In a third period, the controller controls a relative distance between the bonding tool and the stage so that the pressure applied to the semiconductor chip by the bonding tool is kept equal to the target pressure and controls the temperature of the bonding tool to a second target temperature. The second target temperature is higher than the first target temperature.

What is claimed is: 
     
         1 . A semiconductor manufacturing apparatus comprising:
 a stage, on the stage a board and a semiconductor chip are placed, the semiconductor chip being a chip to be bonded to the board via a plurality of bump electrodes; and   a bonding tool configured to suction the semiconductor chip via a tape,   wherein the bonding tool has a first surface and a second surface,   wherein the first surface has a first suction hole, the first suction hole suctioning the semiconductor chip, and   wherein the second surface is arranged on an outer side of the first surface, the second surface being arranged farther from the stage than the first surface when the stage and the bonding tool are faced with each other, and the second surface has a second suction hole.   
     
     
         2 . The semiconductor manufacturing apparatus according to  claim 1 , wherein
 the second surface is a surface nearest to the stage among surfaces arranged on the outer side of the first surface when the stage and the bonding tool are faced with each other.   
     
     
         3 . The semiconductor manufacturing apparatus according to  claim 1 , wherein
 in the bonding tool, there is no surface nearer to the stage than the second surface on an outer side of the second surface when the stage and the bonding tool are faced with each other.   
     
     
         4 . The semiconductor manufacturing apparatus according to  claim 1 , wherein
 in the bonding tool, among the second surface and surfaces arranged on an outer side of the second surface, the second surface is a surface nearest to the stage when the stage and the bonding tool are faced with each other.   
     
     
         5 . The semiconductor manufacturing apparatus according to  claim 1 , wherein
 the bonding tool further has a third surface, the third surface being arranged on an outer side of the second surface, and the third surface being inclined in a direction where a distance from the stage increases as going away from the second surface on the outer side of the second surface when the stage and the bonding tool are faced with each other.   
     
     
         6 . The semiconductor manufacturing apparatus according to  claim 1 , wherein
 the first surface is flat.   
     
     
         7 . The semiconductor manufacturing apparatus according to  claim 1 , wherein
 the second surface is flat.   
     
     
         8 . The semiconductor manufacturing apparatus according to  claim 1 , wherein
 the second suction hole suctions the tape.   
     
     
         9 . The semiconductor manufacturing apparatus according to  claim 1 , wherein
 the second surface is provided to surround the first surface.