US2023051695A1PendingUtilityA1

Package structure

Assignee: HKC CORP LTDPriority: Aug 24, 2017Filed: Nov 1, 2022Published: Feb 16, 2023
Est. expiryAug 24, 2037(~11.1 yrs left)· nominal 20-yr term from priority
Inventors:Jia-He Cheng
H10P 72/17B65D 25/103B65D 2585/6837H01F 7/02B65D 85/48B65D 81/113B65D 81/057B65D 81/058H01F 7/0247H01L 21/6734
68
PatentIndex Score
0
Cited by
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References
0
Claims

Abstract

A package structure includes a backing plate, at least one pad, a frame, a side enclosing plate, a magnetic component and a fixing structure. The backing plate supports a target object. The pad is disposed on the backing plate and fixes the target object. The frame is disposed on a lower side of the backing plate and bonded to the backing plate. The frame supports the backing plate to fix the pad onto the backing plate. The side enclosing plate is disposed around the backing plate and connected to the pad to fix the pad. The magnetic component is disposed on the backing plate and attracting a magnetic coating on the target object. The fixing structure is disposed at an end portion of the frame and connected to the pad to fix the pad.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A package structure, comprising:
 a backing plate supporting a target object;   at least one pad disposed on the backing plate and fixing the target object;   a frame disposed on a lower side of the backing plate, bonded to the backing plate, and supporting the backing plate to fix the pad onto the backing plate;   a side enclosing plate disposed around the backing plate and connected to the pad to fix the pad;   a magnetic component disposed on the backing plate and attracting a magnetic coating on the target object; and   a fixing structure disposed at an end portion of the frame and connected to the pad to fix the pad;   wherein the package structure comprises:   a snap disposed on the frame; and   a slot disposed on the pad and snapping with the snap.   
     
     
         2 . The package structure according to  claim 1 , wherein the magnetic component is a magnetic coating or a magnetic insert. 
     
     
         3 . The package structure according to  claim 1 , wherein the fixing structure is an expansion nail for connecting the frame to the pad, and the pad is provided with a mounting slot for accommodating the expansion nail. 
     
     
         4 . The package structure according to  claim 3 , wherein the expansion nail further comprises:
 a sleeve;   a sliding bar disposed inside the sleeve and slidably fit with the sleeve; and   a driving unit driving the sliding bar to slide along an axis of the sleeve;   wherein the driving unit is disposed on one end of the sliding bar, and a tapered boss for expanding the sleeve is disposed on the other end of the sliding bar.   
     
     
         5 . The package structure according to  claim 4 , wherein the driving unit comprises:
 the driving unit comprising a drive ring threadingly connected to the sliding bar; and   a restricting boss disposed on an end portion of the sleeve and resting against and fit with the drive ring.   
     
     
         6 . The package structure according to  claim 4 , wherein the driving unit comprises:
 a first drive inclined surface disposed on the sliding bar;   a drive slider resting against the first drive inclined surface for driving the sliding bar to slide; and   a pressing ring resting against the driving slider for driving the drive slider to slide;   wherein a second drive inclined surface is disposed on the pressing ring for driving the drive slider to move, an accommodating slot is formed on an end portion of the sleeve for accommodating the drive slider and the pressing ring, the pressing ring is slidably connected to a side surface of the accommodating slot, and the drive slider is slidably connected to a bottom surface of the accommodating slot.   
     
     
         7 . The package structure according to  claim 1 , wherein a buffer pad is disposed on the backing plate, and the buffer pad is located between the backing plate and the target object.

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