US2023044275A1PendingUtilityA1

Stabilization Suspensions And Methods Of Manufacture

Assignee: HUTCHINSON TECHNOLOGYPriority: Aug 16, 2019Filed: Oct 18, 2022Published: Feb 9, 2023
Est. expiryAug 16, 2039(~13 yrs left)· nominal 20-yr term from priority
H01H 51/2281H01H 50/04H01H 50/00F16M 2200/065H04N 23/57G03B 13/36G02B 7/005H04N 23/687G02B 7/023F16M 11/02F16M 13/02G03B 2205/0076G02B 27/646G03B 3/10G03B 30/00H04N 23/685H04N 23/55G03B 5/00H04N 23/54G02B 27/64G02B 7/09G02B 7/02G03B 2205/0007H04N 5/2328H04N 5/2257F16F 1/02F03G 7/0614
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Claims

Abstract

A suspension assembly is described. A suspension assembly including a support member configured to receive at least a first circuit member. The first circuit member including at least a trace. The first circuit member disposed on the support member.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A moving sensor circuit assembly comprising:
 an interposer circuit configured to receive a sensor and to move in one or more directions; and   one or more flexible circuits, wherein each of the one or more flexible circuits include:
 a first portion configured to connect to the interposer circuit; 
 a second portion configured to connect to a printed circuit board (PCB); and 
 one or more traces configured to electrically couple the interposer circuit to the PCB. 
   
     
     
         2 . The moving sensor circuit assembly of  claim 1 , wherein the sensor comprises an image sensor, and wherein the interposer circuit is configured to move in an x-direction and a y-direction as part of an optical image stabilization (OIS) apparatus. 
     
     
         3 . The moving sensor circuit assembly of  claim 1 , further comprising:
 at least two flexible circuits disposed around the interposer circuit, wherein the at least two circuits are separated from one another.   
     
     
         4 . The moving sensor circuit assembly of  claim 1 , wherein the one or more flexible circuits are affixed to the interposer circuit via any of a weld, a solder, or an adhesive. 
     
     
         5 . The moving sensor circuit assembly of  claim 1 , wherein the first portion of each flexible circuit is substantially perpendicular to the second portion. 
     
     
         6 . The moving sensor circuit assembly of  claim 1 , wherein the first portion of each flexible circuit comprises a lower stiffness than the second portion to allow for movement of the interposer circuit in the at least one direction. 
     
     
         7 . The moving sensor circuit assembly of  claim 1 , further comprising four flexible circuits disposed about the interposer circuit. 
     
     
         8 . The moving sensor circuit assembly of  claim 1 , wherein the first portion of each flexible circuit includes an angle of around 90 degrees, wherein the first portion is configured to bend around a corner of the interposer circuit. 
     
     
         9 . A flexible circuit comprising:
 a first portion configured to connect to an interposer circuit that is part of a moving sensor circuit assembly;   a second portion configured to connect to a printed circuit board (PCB); and   one or more traces disposed along the first portion and the second portion and configured to electrically couple the interposer circuit to the PCB.   
     
     
         10 . The flexible circuit of  claim 9 , wherein the first portion of the flexible circuit is substantially perpendicular to the second portion. 
     
     
         11 . The flexible circuit of  claim 9 , wherein the first portion of the flexible circuit comprises a lower stiffness than the second portion to allow for movement of the interposer circuit in the at least one direction. 
     
     
         12 . The flexible circuit of  claim 9 , wherein the first portion of the flexible circuit includes an angle of around 90 degrees, wherein the first portion is configured to bend around a corner of the interposer circuit. 
     
     
         13 . A system comprising:
 an interposer circuit configured to move along an x-axis and/or a y-axis;   an image sensor configured to be connected to the interposer circuit;   a printed circuit board (PCB); and   a flexible circuit comprising:
 a first portion configured to connect to the interposer circuit; 
 a second portion configured to connect to the PCB; and 
 one or more traces disposed along the first portion and the second portion and configured to electrically couple the interposer circuit to the PCB. 
   
     
     
         14 . The system of  claim 13 , wherein the sensor comprises an image sensor, and wherein the interposer circuit is part of an optical image stabilization (OIS) apparatus. 
     
     
         15 . The system of  claim 13 , further comprising:
 at least two flexible circuits disposed around the interposer circuit, wherein the at least two circuits are separated from one another.   
     
     
         16 . The system of  claim 13 , wherein flexible circuit is affixed to the interposer circuit via any of a weld, a solder, or an adhesive. 
     
     
         17 . The system of  claim 13 , wherein the first portion of the flexible circuit is substantially perpendicular to the second portion. 
     
     
         18 . The system of  claim 13 , wherein the first portion of the flexible circuit comprises a lower stiffness than the second portion to allow for movement of the interposer circuit in the at least one direction. 
     
     
         19 . The system of  claim 13 , further comprising four flexible circuits disposed about the interposer circuit. 
     
     
         20 . The system of  claim 13 , wherein the first portion of the flexible circuit includes an angle of around 90 degrees, wherein the first portion is configured to bend around a corner of the interposer circuit.

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