US2023044021A1PendingUtilityA1

Solar cells having junctions retracted from cleaved edges

Assignee: SUNPOWER CORPPriority: Apr 16, 2018Filed: Oct 24, 2022Published: Feb 9, 2023
Est. expiryApr 16, 2038(~11.7 yrs left)· nominal 20-yr term from priority
H10F 77/311H10F 77/122H10F 77/14H10F 71/129H10F 10/146H10F 19/902H10F 19/10H10F 71/121Y02E10/547Y02P70/50H01L 31/0682H01L 31/0352H01L 31/047H01L 31/1868H01L 31/02167H01L 31/028
71
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

Methods of fabricating solar cells having junctions retracted from cleaved edges, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a light-receiving surface, a back surface, and sidewalls. An emitter region is in the substrate at the light-receiving surface of the substrate. The emitter region has sidewalls laterally retracted from the sidewalls of the substrate. A passivation layer is on the sidewalls of the emitter region.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A method of fabricating a solar cell, the method comprising:
 forming an emitter region in a substrate, at a light-receiving surface of the substrate;   forming a trench in the emitter region;   forming a passivation layer on the light-receiving surface of the substrate and in the trench to passivate an emitter edge; and   cleaving the substrate to form a solar cell having sidewalls and an emitter region having sidewalls laterally retracted from the sidewalls of the solar cell.   
     
     
         2 . The method of  claim 1 , wherein cleaving the substrate comprises cleaving through the passivation layer in the trench. 
     
     
         3 . The method of  claim 1 , wherein cleaving substrate comprises cleaving through a portion of the emitter region laterally adjacent the trench. 
     
     
         4 . The method of  claim 1 , wherein the trench is formed using laser ablation. 
     
     
         5 . The method of  claim 1 , wherein the trench is formed using an etch paste delivered by screen print or inkjet.

Join the waitlist — get patent alerts

Track US2023044021A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.