US2023044021A1PendingUtilityA1
Solar cells having junctions retracted from cleaved edges
Est. expiryApr 16, 2038(~11.7 yrs left)· nominal 20-yr term from priority
H10F 77/311H10F 77/122H10F 77/14H10F 71/129H10F 10/146H10F 19/902H10F 19/10H10F 71/121Y02E10/547Y02P70/50H01L 31/0682H01L 31/0352H01L 31/047H01L 31/1868H01L 31/02167H01L 31/028
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Claims
Abstract
Methods of fabricating solar cells having junctions retracted from cleaved edges, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a light-receiving surface, a back surface, and sidewalls. An emitter region is in the substrate at the light-receiving surface of the substrate. The emitter region has sidewalls laterally retracted from the sidewalls of the substrate. A passivation layer is on the sidewalls of the emitter region.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method of fabricating a solar cell, the method comprising:
forming an emitter region in a substrate, at a light-receiving surface of the substrate; forming a trench in the emitter region; forming a passivation layer on the light-receiving surface of the substrate and in the trench to passivate an emitter edge; and cleaving the substrate to form a solar cell having sidewalls and an emitter region having sidewalls laterally retracted from the sidewalls of the solar cell.
2 . The method of claim 1 , wherein cleaving the substrate comprises cleaving through the passivation layer in the trench.
3 . The method of claim 1 , wherein cleaving substrate comprises cleaving through a portion of the emitter region laterally adjacent the trench.
4 . The method of claim 1 , wherein the trench is formed using laser ablation.
5 . The method of claim 1 , wherein the trench is formed using an etch paste delivered by screen print or inkjet.Join the waitlist — get patent alerts
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