Solid resin molding material, molded product, and method for producing molded product

Abstract

A solid resin molding material according to the present invention includes a thermosetting resin (A), a curing agent (B), a carboxylic acid-based dispersant (C), and magnetic particles (D).

1 . A solid resin molding material comprising:
 (A) a thermosetting resin;   (B) a curing agent;   (C) a carboxylic acid-based dispersant; and   (D) magnetic particles.   
     
     
         2 . The solid resin molding material according to  claim 1 ,
 wherein the carboxylic acid-based dispersant (C) includes a polycarboxylic acid-based dispersant.   
     
     
         3 . The solid resin molding material according to  claim 1 ,
 wherein the carboxylic acid-based dispersant (C) includes at least one compound represented by General Formula (1),   
       
         
           
           
               
               
           
         
         wherein, in General Formula (1), R represents a hydrogen atom, a carboxyl group, a hydroxyl group, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, an alkylcarboxyl group having 1 to 5 carbon atoms, an alkoxycarboxyl group having 1 to 5 carbon atoms, an alkyl alcohol group having 1 to 5 carbon atoms, or an alkoxy alcohol group having 1 to 5 carbon atoms, a plurality of R's may be the same or different from each other, X represents an oxygen atom, an alkylene group having 1 to 30 carbon atoms, a divalent chain hydrocarbon group having 1 to 30 carbon atoms and having one or more double bonds, or a divalent chain hydrocarbon group having 1 to 30 carbon atoms and having one or more triple bonds, a plurality of X's may be the same or different from each other, n represents an integer of 0 to 20, and m represents an integer of 1 to 5. 
       
     
     
         4 . The solid resin molding material according to  claim 3 ,
 wherein the carboxylic acid-based dispersant (C) includes at least one compound represented by General Formula (1a),   
       
         
           
           
               
               
           
         
         wherein, in General Formula (1a), R, m, and n have the same definition as in General Formula (1). 
       
     
     
         5 . The solid resin molding material according to  claim 1 ,
 wherein the carboxylic acid-based dispersant (C) includes at least one compound represented by General Formula (1b),   
       
         
           
           
               
               
           
         
         wherein, in General Formula (1b), Q represents an alkylene group having 1 to 5 carbon atoms, and X 1  represents an alkylene group having 1 to 30 carbon atoms, a divalent chain hydrocarbon group having 1 to 30 carbon atoms and having one or more double bonds, or a divalent chain hydrocarbon group having 1 to 30 carbon atoms and having one or more triple bonds. 
       
     
     
         6 . The solid resin molding material according to  claim 1 ,
 wherein an acid value of the carboxylic acid-based dispersant (C) is equal to or more than 5 mgKOH/g and equal to or less than 500 mgKOH/g.   
     
     
         7 . The solid resin molding material according to  claim 1 ,
 wherein the carboxylic acid-based dispersant (C) is solid or waxy.   
     
     
         8 . The solid resin molding material according to  claim 1 ,
 wherein a content of the carboxylic acid-based dispersant (C) is equal to or more than 0.01% by mass and equal to or less than 2% by mass.   
     
     
         9 . The solid resin molding material according to  claim 1 ,
 wherein the magnetic particles (D) are soft magnetic particles (D1) or hard magnetic particles (D2).   
     
     
         10 . The solid resin molding material according to  claim 9 ,
 wherein a content of the soft magnetic particles (D1) is equal to or more than 70% by volume and equal to or less than 90% by volume.   
     
     
         11 . The solid resin molding material according to  claim 9 ,
 wherein the soft magnetic particles (D1) include one or more elements selected from Fe, Ni, Si, and Co.   
     
     
         12 . The solid resin molding material according to  claim 9 ,
 wherein a content of the hard magnetic particles (D2) is equal to or more than 45% by volume and equal to or less than 80% by volume.   
     
     
         13 . The solid resin molding material according to  claim 9 ,
 wherein the hard magnetic particles (D2) include at least one selected from a ferrite magnet, a samarium iron nitrogen magnet, a samarium cobalt magnet, and a neodymium magnet.   
     
     
         14 . The solid resin molding material according to  claim 1 ,
 wherein the thermosetting resin (A) includes an epoxy resin.   
     
     
         15 . The solid resin molding material according to  claim 1 ,
 wherein the curing agent (B) includes a phenol-based curing agent.   
     
     
         16 . The solid resin molding material according to  claim 1 , further comprising:
 a compound (E) represented by General Formula (2),   
       
         
           
           
               
               
           
         
         wherein, in General Formula (2), Y 1 , Y 2 , and Y 3  each independently represent an alkoxy group having 1 to 3 carbon atoms or an alkyl group having 1 to 3 carbon atoms, where at least two of Y 1 , Y 2 , and Y 3  are alkoxy groups having 1 to 3 carbon atoms, L represents a linear or branched alkylene group having 1 to 17 carbon atoms, and G represents a vinyl group, an epoxy group, a glycidyl ether group, an oxetanyl group, a (meth)acryloyl group, an amino group, a methyl group, or an anilino group. 
       
     
     
         17 . The solid resin molding material according to  claim 1 ,
 wherein a flow length measured by a spiral flow test at a temperature of 175° C. is equal to or more than 15 cm.   
     
     
         18 . The solid resin molding material according to  claim 1 ,
 wherein a melt viscosity measured at a temperature condition of 175° C. using a constant load extrusion type capillary rheometer is equal to or more than 0.1 Pa·s and equal to or less than 300 Pa·s.   
     
     
         19 . The solid resin molding material according to  claim 1 ,
 wherein the solid resin molding material is in a form of tablets or granules at 23° C.   
     
     
         20 . A molded product obtained by curing the solid resin molding material according to  claim 1 . 
     
     
         21 . A method for producing a molded product, comprising:
 a step of injecting a molten material of the solid resin molding material according to  claim 1  into a mold using a transfer molding apparatus; and   a step of curing the molten material.   
     
     
         22 . A method for producing a molded product, comprising:
 a step of compression-molding the solid resin molding material according to  claim 1 .