Floor Sanding Device, Floor Treatment Plate and Method for Sanding a Floor

Abstract

The present invention relates to a floor sanding device for sanding a floor. The invention further relates to a floor treatment plate and a method for sanding a floor. The floor sanding device comprises: —a carrier plate and a drive for driving the carrier plate; —a treatment plate for treating a surface of a floor, wherein the treatment plate is operatively coupled to the carrier plate; and —an intermediary plate that is arranged between the carrier plate and the treatment plate, wherein the intermediary plate comprises at least one compartment for receiving at least one pressure member for providing a higher local pressure.

1 . A floor sanding device, comprising:
 a carrier plate and a drive for driving the carrier plate;   a treatment plate for treating a surface of a floor, wherein the treatment plate is operatively coupled to the carrier plate; and   an intermediary plate that is arranged between the carrier plate and the treatment plate,   wherein the intermediary plate comprises at least one compartment for receiving at least one pressure member for providing a higher local pressure.   
     
     
         2 . The floor sanding device according to  claim 1 , wherein the floor sanding device further comprises at least one pressure member that is configured for placement in the at least one compartment, wherein a stiffness of the at least one pressure member is higher than a stiffness of the intermediary plate. 
     
     
         3 . The floor sanding device according to  claim 2 , wherein the at least one pressure member is removably provided in the at least one compartment. 
     
     
         4 . The floor sanding device according to  claim 2 , wherein a ratio between the stiffness of the at least one pressure member to the stiffness of the intermediary plate is greater than 1.5, preferably greater than 5 and most preferably greater than 10. 
     
     
         5 . The floor sanding device according to  claim 2 , wherein the at least one pressure member comprises rubber. 
     
     
         6 . The floor sanding device according to  claim 1 , wherein the compartments are disc-shaped. 
     
     
         7 . The floor sanding device according to  claim 1 , wherein the intermediary plate comprises three compartments that are symmetrically distributed around a center point of the intermediary plate. 
     
     
         8 . The floor sanding device according to  claim 1 , wherein the floor sanding device is a planetary floor sanding device. 
     
     
         9 . The floor sanding device according to  claim 1 , wherein the intermediary plate is at least partially flexible. 
     
     
         10 . The floor sanding device according to  claim 1 , further comprising a damping plate that is arranged between the carrier plate and the intermediary plate for partially dampening the sanding during use. 
     
     
         11 . The floor sanding device according to  claim 1 , wherein the treatment plate comprises air holes. 
     
     
         12 . The floor sanding device according to  claim 11 , wherein the air holes are distributed unevenly on the floor treatment plate. 
     
     
         13 . The floor sanding device according to  claim 12 , wherein the air holes are distributed such that they are located in a different location than the at least one compartment of the treatment plate as seen in a direction perpendicular to a plane parallel to the floor. 
     
     
         14 . The floor sanding device according to  claim 11 , wherein the intermediary plate comprises air holes, wherein the air holes are located at substantially the same location as the air holes in the treatment plate as seen in a direction perpendicular to a plane parallel to the floor. 
     
     
         15 . The floor sanding device according to  claim 11 , wherein the carrier plate comprises air holes, wherein the air holes are located at substantially the same location as the air holes in the treatment plate and/or intermediary plate as seen in a direction perpendicular to a plane parallel to the floor. 
     
     
         16 . The floor sanding device according to  claim 1 , wherein the intermediary plate is attached to the carrier plate with a hook-and-loop fastener connection. 
     
     
         17 . The floor treatment plate for use with a floor sanding device according to  claim 1 , the floor treatment plate comprising air holes that are distributed unevenly over the floor treatment plate for providing cooling and/or suctioning of dust. 
     
     
         18 . The floor treatment plate according to  claim 17 , wherein the air holes are distributed in three groups, and wherein each of the three groups has a group center point, wherein the group center points are provided at 120° from each other around a treatment center point from the floor treatment plate. 
     
     
         19 . A method for sanding a floor, comprising:
 providing a floor sanding device according to  claim 1 ; and   sanding the floor with the floor sanding device.   
     
     
         20 . The method for sanding a floor of  claim 19 , further comprising:
 changing the at least one pressure member from the intermediary plate.