Copper electroplating solution, method of producing same, and copper electroplating method

Abstract

The present invention provides a copper electroplating solution including: (A) a sulfate ion; (B) a compound represented by the following general formula (1); and (C) a copper ion, wherein the copper electroplating solution has a content of the component (B) of from 0.3 part by mass to 50 parts by mass and a content of the component (C) of from 5 parts by mass to 50 parts by mass with respect to 100 parts by mass of a content of the component (A):where R1 and R2 each independently represent a hydrogen atom, a sodium atom, a potassium atom, or an alkyl group having 1 to 5 carbon atoms, and “n” represents 1 or 2, a method of producing the copper electroplating solution, and a copper electroplating method including using the copper electroplating solution.

1 . A copper electroplating solution, comprising the following components:
 (A) a sulfate ion;   (B) a compound represented by the following general formula (1); and   (C) a copper ion,   wherein the copper electroplating solution has a content of the component (B) of from 0.3 part by mass to 50 parts by mass and a content of the component (C) of from 5 parts by mass to 50 parts by mass with respect to 100 parts by mass of a content of the component (A):   
       
         
           
           
               
               
           
         
       
       where R 1  and R 2  each independently represent a hydrogen atom, a sodium atom, a potassium atom, or an alkyl group having 1 to 5 carbon atoms, and “n” represents 1 or 2. 
     
     
         2 . The copper electroplating solution according to  claim 1 , wherein the R 1  represents a hydrogen atom, a sodium atom, or a potassium atom, and the R 2  represents a hydrogen atom. 
     
     
         3 . The copper electroplating solution according to  claim 1 , further comprising a chloride ion. 
     
     
         4 . The copper electroplating solution according to  claim 1 , wherein 1 L of the copper electroplating solution comprises 10 g to 500 g of the component (A). 
     
     
         5 . A copper electroplating method, comprising using the copper electroplating solution of  claim 1 . 
     
     
         6 . A method of producing a copper electroplating solution, comprising mixing a sulfate ion supply source, a compound represented by the following general formula (1), a copper ion supply source, and a solvent,
 wherein the copper electroplating solution has a content of the compound represented by the general formula (1) of from 0.3 part by mass to 50 parts by mass and a content of a copper ion of from 5 parts by mass to 50 parts by mass with respect to 100 parts by mass of a content of a sulfate ion:   
       
         
           
           
               
               
           
         
       
       where R 1  and R 2  each independently represent a hydrogen atom, a sodium atom, a potassium atom, or an alkyl group having 1 to 5 carbon atoms, and “n” represents 1 or 2. 
     
     
         7 . The method of producing a copper electroplating solution according to  claim 6 , wherein the R 1  represents a hydrogen atom, a sodium atom, or a potassium atom, and the R 2  represents a hydrogen atom. 
     
     
         8 . The method of producing a copper electroplating solution according to  claim 6 , wherein 1 L of the copper electroplating solution comprises 10 g to 500 g of the component (A).