Packaged electronic device with suspended magnetic subassembly

Abstract

A packaged electronic device includes a die pad directly connected to a first set of conductive leads of a leadframe structure, a semiconductor die attached to the conductive die pad, a conductive support structure directly connected to a second set of conductive leads, and spaced apart from all other conductive structures of the leadframe structure. A magnetic assembly is attached to the conductive support structure, and a molded package structure that encloses the conductive die pad, the conductive support structure, the semiconductor die, the magnetic assembly and portions of the conductive leads, the molded package structure including a top side, and an opposite bottom side, wherein the lamination structure is centered between the top and bottom sides.

1 - 14 . (canceled) 
     
     
         15 . A method for fabricating an electronic device, the method comprising:
 providing a leadframe structure, including a conductive die pad connected to a first set of conductive leads, and a conductive support structure connected to a second set of the conductive leads and spaced apart from all other conductive structures of the leadframe structure;   attaching a magnetic assembly to the conductive support structure;   attaching a semiconductor die to the conductive die pad;   forming a first connection between a first conductive feature of the semiconductor die and a first conductive lead of the conductive leads, and a second connection between a second conductive feature of the semiconductor die and a conductive feature of the magnetic assembly; and   enclosing the conductive die pad, the conductive support structure, the semiconductor die, the magnetic assembly and portions of the conductive leads in a package structure.   
     
     
         16 . The method of  claim 15 , further comprising:
 attaching a second semiconductor die to a second conductive die pad that is spaced apart from the conductive support structure of the leadframe structure;   forming a third connection between a first conductive feature of the second semiconductor die and a second one of the conductive leads, and a fourth connection between a second conductive feature of the second semiconductor die and a second conductive feature of the magnetic assembly.   
     
     
         17 . The method of  claim 15 , wherein the magnetic assembly includes a lamination structure with a patterned conductive feature that forms a part of a passive electronic component; and wherein attaching the magnetic assembly to the conductive support structure includes attaching the lamination structure to the conductive support structure. 
     
     
         18 . The method of  claim 17 , wherein the package structure includes a top side and an opposite bottom side; and wherein the lamination structure is centered between the top and bottom sides. 
     
     
         19 . The method of  claim 17 , wherein the package structure includes a first lateral side and an opposite second lateral side; wherein portions of the individual conductive leads extend outward from the package structure along a corresponding one of the first and second lateral sides; and wherein the magnetic assembly is centered between the first and second lateral sides. 
     
     
         20 . The method of  claim 17 ,
 wherein the conductive support structure includes:
 a first conductive support member directly connected to a first group of the second set of the conductive leads, and spaced apart from all other conductive structures of the leadframe structure, and 
 a second conductive support member directly connected to a second group of the second set of the conductive leads, and spaced apart from all other conductive structures of the leadframe structure; and 
   wherein attaching the magnetic assembly to the conductive support structure includes attaching the lamination structure to the first and second conductive support members.   
     
     
         21 . A method for fabricating an electronic device, the method comprising:
 directly connecting a conductive die pad to a first set of conductive leads;   directly connecting a conductive support structure to a second set of the conductive leads;   attaching a semiconductor die to the conductive die pad;   attaching a magnetic assembly to the conductive support structure; and   enclosing the conductive die pad, the conductive support structure, the semiconductor die, the magnetic assembly and portions of the conductive leads with a package structure.   
     
     
         22 . The method of  claim 21 , further including:
 directly connecting a second conductive die pad to a third set of the conductive leads, and spaced apart from the conductive support structure; and   attaching a second semiconductor die attached to the second conductive die pad.   
     
     
         23 . The method of  claim 22 , further comprising:
 connecting a first bond wire connected between the semiconductor die and a first conductive lead of the conductive leads;   connecting a second bond wire between the semiconductor die and the magnetic assembly;   connecting a third bond wire between the second semiconductor die and a second conductive lead of the conductive leads; and   connecting a fourth bond wire connected between the second semiconductor die and the magnetic assembly.   
     
     
         24 . The method of  claim 21 , further including:
 directly connecting a second conductive support member to a second group of the second set of the conductive leads, and spaced apart from all other conductive structures of the leadframe structure; and   attaching the magnetic assembly to the first and second conductive support members.   
     
     
         25 . The method of  claim 24 ,
 wherein the magnetic assembly includes:
 a lamination structure, including a patterned conductive feature that forms a part of a passive electronic component, 
 a first core structure attached to a first side of the lamination structure, and 
 a second core structure attached to a second side of the lamination structure; and 
   wherein the lamination structure is attached to the first and second conductive support members.   
     
     
         26 . The method of  claim 24 ,
 wherein the package structure includes a first lateral side and an opposite second lateral side;   wherein portions of the individual conductive leads extend outward from the package structure along a corresponding one of the first and second lateral sides; and   wherein the magnetic assembly is centered between the first and second lateral sides.   
     
     
         27 . The method of  claim 22 ,
 wherein the package structure includes a first lateral side and an opposite second lateral side;   wherein portions of the individual conductive leads extend outward from the package structure along a corresponding one of the first and second lateral sides; and   wherein the magnetic assembly is centered between the first and second lateral sides.   
     
     
         28 . The method of  claim 21 , wherein the magnetic assembly includes:
 a lamination structure, including a patterned conductive feature that forms a part of a passive electronic component,   a first core structure attached to a first side of the lamination structure, and   a second core structure attached to a second side of the lamination structure, wherein the lamination structure is attached to the conductive support structure.   
     
     
         29 . The method of  claim 21 ,
 wherein the package structure includes a first lateral side and an opposite second lateral side;   wherein portions of the individual conductive leads extend outward from the package structure along a corresponding one of the first and second lateral sides; and   wherein the magnetic assembly is centered between the first and second lateral sides.   
     
     
         30 . The method of  claim 21 ,
 wherein the package structure includes a top side and an opposite bottom side;   wherein the magnetic assembly includes a lamination structure, including a patterned conductive feature that forms a part of a passive electronic component; and   wherein the lamination structure is centered between the top and bottom sides.   
     
     
         31 . A method for fabricating an electronic device, the method comprising:
 directly connecting a conductive die pad to a first set of conductive leads of a leadframe structure;   attaching a semiconductor die to the conductive die pad;   directly connecting a conductive support structure to a second set of conductive leads;   attaching a magnetic assembly including a lamination structure to the conductive support structure; and   enclosing with a molded package structure the conductive die pad, the conductive support structure, the semiconductor die, the magnetic assembly and portions of the conductive leads, the molded package structure including a top side, and an opposite bottom side, wherein the lamination structure is centered between the top and bottom sides.   
     
     
         32 . The method of  claim 31 , wherein the conductive support structure includes:
 a first conductive support member directly connected to a first group of the second set of the conductive leads, and spaced apart from all other conductive structures of the leadframe structure, and   a second conductive support member directly connected to a second group of the second set of the conductive leads, and spaced apart from all other conductive structures of the leadframe structure, wherein the lamination structure is attached to the first and second conductive support members; and   a molded package structure that encloses the conductive die pad, the conductive support structure, the semiconductor die, the magnetic assembly and portions of the conductive leads, the molded package structure including a top side, and an opposite bottom side, wherein the lamination structure is centered between the top and bottom sides.   
     
     
         33 . The method of  claim 31 ,
 wherein the package structure includes a first lateral side and an opposite second lateral side;   wherein portions of the individual conductive leads extend outward from the package structure along a corresponding one of the first and second lateral sides; and   wherein the magnetic assembly is centered between the first and second lateral sides.   
     
     
         34 . The method of  claim 31 ,
 wherein the leadframe structure further includes a second conductive die pad directly connected to a third set of the conductive leads, and spaced apart from the conductive support structure; and   wherein the device further includes a second semiconductor die attached to the second conductive die pad.   
     
     
         35 . The method of  claim 34 , further comprising:
 connecting a first bond wire between the semiconductor die and a first conductive lead of the conductive leads;   connecting a second bond wire between the semiconductor die and the magnetic assembly;   connecting a third bond wire between the second semiconductor die and a second conductive lead of the conductive leads; and   connecting a fourth bond wire between the second semiconductor die and the magnetic assembly.   
     
     
         23 . The device of claim  13 ,
 wherein the magnetic assembly includes:
 a lamination structure, including a patterned conductive feature that forms a part of a passive electronic component, 
 a first core structure attached to a first side of the lamination structure, and 
 a second core structure attached to a second side of the lamination structure; and 
   wherein the lamination structure is attached to the first and second conductive support members.