Substrate processing system

Abstract

A substrate processing system installed on a floor face is provided. The substrate processing system includes a substrate transfer module, a supporting table including a top plate disposed separately from the floor face, a plurality of substrate processing modules disposed on the top plate and coupled to the substrate transfer module along a lateral side of the substrate transfer module, and a plurality of power units disposed below the top plate. Further, the plurality of power units correspond to the plurality of substrate processing modules, respectively, and each of the power units is configured to supply electric power to the corresponding processing module.

1 . A substrate processing system, comprising:
 a vacuum transfer module extending along a longitudinal axis of the substrate processing system;   a plurality of process modules including a plurality of first process modules and a plurality of second process modules, the plurality of first process modules being coupled to the vacuum transfer module along a first lateral side of the vacuum transfer module, the plurality of second process modules being coupled to the vacuum transfer module along a second lateral side of the vacuum transfer module;   a plurality of electrical units including a plurality of first electrical units and a plurality of second electrical units, the plurality of first electrical units corresponding to the plurality of first process modules, respectively, each first electrical units being disposed on the corresponding first process module, the plurality of second electrical units corresponding to the plurality of second process modules, respectively, each second electrical units being disposed on the corresponding second process module;   a lower space defined underneath the vacuum transfer module, the lower space extending along the longitudinal axis of the substrate processing system from a front end to a rear end of the vacuum transfer module, the lower space being defined between the plurality of first process modules and the plurality of second process modules; and   an upper space defined above the vacuum transfer module, the upper space extending along the longitudinal axis of the substrate processing system from the front end to the rear end of the vacuum transfer module, the upper space being defined between the plurality of first electrical units and the plurality of second electrical units.   
     
     
         2 . The substrate processing system of  claim 1 , wherein the vacuum transfer module is formed in a long and flat rectangular shape. 
     
     
         3 . The substrate processing system of  claim 1 , further comprising a plurality of gas boxes including a plurality of first gas boxes and a plurality of second gas boxes, the plurality of first gas boxes corresponding to the plurality of first process modules, respectively, each first gas boxes being disposed adjacent to the first electrical units disposed on the corresponding first process module, the plurality of second gas boxes corresponding to the plurality of second process modules, respectively, each second gas boxes being disposed adjacent to the second electrical units disposed on the corresponding second process module. 
     
     
         4 . The substrate processing system of  claim 3 , wherein the gas box is configured to supply a gas to the corresponding process module. 
     
     
         5 . The substrate processing system of  claim 3 , wherein the plurality of first gas boxes face the plurality of second gas boxes, the upper space is defined between the plurality of first gas boxes and the plurality of second gas boxes. 
     
     
         6 . The substrate processing system of  claim 1 , wherein an upper surface of the vacuum transfer module is lower than an upper surface of the process module. 
     
     
         7 . The substrate processing system of  claim 6 , wherein the lower space has a vertical dimension of 180 cm or less. 
     
     
         8 . The substrate processing system of  claim 6 , wherein the lower space has a vertical dimension of 170 cm or less. 
     
     
         9 . The substrate processing system of  claim 6 , further comprising:
 a plurality of load lock modules coupled to the vacuum transfer module along the front end of the vacuum transfer module; and   an atmospheric transfer module coupled to the plurality of load lock modules.   
     
     
         10 . The substrate processing system of  claim 9 , wherein the upper surface of the load lock module is lower than the upper surface of the process module. 
     
     
         11 . The substrate processing system of  claim 10 , wherein the upper surface of the process module is lower than an upper surface of the atmospheric transfer module. 
     
     
         12 . The substrate processing system of  claim 11 , wherein the upper surface of the atmospheric transfer module is lower than an upper surface of the electrical units. 
     
     
         13 . The substrate processing system of  claim 1 , wherein the electrical unit includes electrical parts for controlling the corresponding process module. 
     
     
         14 . The substrate processing system of  claim 1 , wherein the plurality of first process modules include six first process modules, the plurality of second process modules include six second process modules. 
     
     
         15 . A substrate processing system, comprising:
 a vacuum transfer module extending along a longitudinal axis of the substrate processing system;   a plurality of first process modules coupled to the vacuum transfer module along a first lateral side of the vacuum transfer module;   a plurality of second process modules coupled to the vacuum transfer module along a second lateral side of the vacuum transfer module;   a plurality of first electrical units disposed on the plurality of first process modules;   a plurality of second electrical units disposed on the plurality of second process modules;   a lower space defined underneath the vacuum transfer module, the lower space extending along the longitudinal axis of the substrate processing system from a front end to a rear end of the vacuum transfer module, the lower space being defined between the plurality of first process modules and the plurality of second process modules; and   an upper space defined above the vacuum transfer module, the upper space extending along the longitudinal axis of the substrate processing system from the front end to the rear end of the vacuum transfer module, the upper space being defined between the plurality of first electrical units and the plurality of second electrical units.   
     
     
         16 . The substrate processing system of  claim 15 , wherein the vacuum transfer module is formed in a long and flat rectangular shape. 
     
     
         17 . The substrate processing system of  claim 15 , further comprising:
 a plurality of first gas boxes disposed adjacent to the plurality of first electrical units; and   a plurality of second gas boxes disposed adjacent to the plurality of second electrical units.   
     
     
         18 . The substrate processing system of  claim 17 , wherein the plurality of first gas boxes face the plurality of second gas boxes, the upper space is defined between the plurality of first gas boxes and the plurality of second gas boxes. 
     
     
         19 . The substrate processing system of  claim 15 , wherein the plurality of first process modules include six first process modules, the plurality of second process modules include six second process modules. 
     
     
         20 . A substrate processing system, comprising:
 a vacuum transfer module extending along a longitudinal axis of the substrate processing system;   a plurality of process modules including a plurality of first process modules and a plurality of second process modules, the plurality of first process modules being coupled to the vacuum transfer module along a first lateral side of the vacuum transfer module, the plurality of second process modules being coupled to the vacuum transfer module along a second lateral side of the vacuum transfer module;   a plurality of gas boxes including a plurality of first gas boxes and a plurality of second gas boxes, the plurality of gas boxes corresponding to the plurality of first process modules, respectively, each first gas box being disposed above the corresponding first process module, the plurality of second gas boxes corresponding to the plurality of second process modules, respectively, each second gas box being disposed above the corresponding second process module;   a lower space defined underneath the vacuum transfer module, the lower space extending along the longitudinal axis of the substrate processing system from a front end to a rear end of the vacuum transfer module, the lower space being defined between the plurality of first process modules and the plurality of second process modules; and   an upper space defined above the vacuum transfer module, the upper space extending along the longitudinal axis of the substrate processing system from the front end to the rear end of the vacuum transfer module, the upper space being defined between the plurality of first gas boxes and the plurality of second gas boxes.   
     
     
         21 . The substrate processing system of  claim 20 , wherein the vacuum transfer module is formed in a long and flat rectangular shape. 
     
     
         22 . The substrate processing system of  claim 20 , wherein an upper surface of the vacuum transfer module is lower than an upper surface of the process module. 
     
     
         23 . The substrate processing system of  claim 22 , wherein the lower space has a vertical dimension of 180 cm or less. 
     
     
         24 . The substrate processing system of  claim 22 , wherein the lower space has a vertical dimension of 170 cm or less. 
     
     
         25 . The substrate processing system of  claim 20 , further comprising:
 a plurality of load lock modules coupled to the vacuum transfer module along the front end of the vacuum transfer module; and   an atmospheric transfer module coupled to the plurality of load lock modules.   
     
     
         26 . The substrate processing system of  claim 25 , wherein the upper surface of the load lock module is lower than the upper surface of the process module. 
     
     
         27 . The substrate processing system of  claim 26 , wherein the upper surface of the process module is lower than an upper surface of the atmospheric transfer module. 
     
     
         28 . The substrate processing system of  claim 20 , wherein the plurality of first process modules include six first process modules, the plurality of second process modules include six second process modules. 
     
     
         29 . A substrate processing system, comprising:
 a vacuum transfer module extending along a longitudinal axis of the substrate processing system;   a plurality of first process modules coupled to the vacuum transfer module along a first lateral side of the vacuum transfer module;   a plurality of second process modules coupled to the vacuum transfer module along a second lateral side of the vacuum transfer module;   a plurality of first gas boxes disposed above the plurality of first process modules;   a plurality of second gas boxes disposed above the plurality of second process modules;   a lower space defined underneath the vacuum transfer module, the lower space extending along the longitudinal axis of the substrate processing system from a front end to a rear end of the vacuum transfer module, the lower space being defined between the plurality of first process modules and the plurality of second process modules; and   an upper space defined above the vacuum transfer module, the upper space extending along the longitudinal axis of the substrate processing system from the front end to the rear end of the vacuum transfer module, the upper space being defined between the plurality of first gas boxes and the plurality of second gas boxes.   
     
     
         30 . The substrate processing system of  claim 29 , wherein the vacuum transfer module is formed in a long and flat rectangular shape. 
     
     
         31 . The substrate processing system of  claim 29 , wherein the plurality of first process modules include six first process modules, the plurality of second process modules include six second process modules.