Polishing method, and polishing composition and method for producing the same

Abstract

A polishing method according to the present invention, includes polishing a polishing object containing a silicon material by using a polishing composition containing abrasive grains, a tri- or more polyvalent hydroxy compound and a dispersing medium and having pH of less than 6.0.

1 - 7 . (canceled) 
     
     
         8 . A polishing composition comprising abrasive grains, a tri- or more polyvalent hydroxy compound, and a dispersing medium and having pH of less than 6.0,
 wherein the abrasive grains are cation-modified colloidal silica, and   wherein the polishing composition does not comprise an oxidizing agent.   
     
     
         9 . The polishing composition according to  claim 8 , wherein the tri- or more polyvalent hydroxy compound has a molecular weight of 90 or more. 
     
     
         10 . The polishing composition according to  claim 8 , wherein the tri- or more polyvalent hydroxy compound is a sugar alcohol. 
     
     
         11 . The polishing composition according to  claim 8 , wherein the pH is 2.0 or more and 5.5 or less. 
     
     
         12 . The polishing composition according to  claim 8 , wherein the silicon material has an oxygen atom and a silicon atom. 
     
     
         13 . The polishing composition of  claim 8 , wherein the tri- or more polyvalent hydroxy compound is at least one selected from the group consisting of (2R,3R,4S)-pentane-1,2,3,4,5-pentole, (2R,3R,4S,5S)-hexane-1,2,3,4,5,6-hexol, and xylitol. 
     
     
         14 . A polishing composition consisting of abrasive grains, a tri- or more polyvalent hydroxy compound, a pH adjusting agent, and a dispersing medium and having pH of less than 6.0, and
 wherein the abrasive grains are cation-modified colloidal silica.   
     
     
         15 . The polishing composition according to  claim 14 , wherein the tri- or more polyvalent hydroxy compound has a molecular weight of 90 or more. 
     
     
         16 . The polishing composition according to  claim 14 , wherein the tri- or more polyvalent hydroxy compound is a sugar alcohol. 
     
     
         17 . The polishing composition according to  claim 14 , wherein the pH is 2.0 or more and 5.5 or less. 
     
     
         18 . The polishing composition according to  claim 14 , wherein the silicon material has an oxygen atom and a silicon atom. 
     
     
         19 . A polishing composition consisting of abrasive grains, a tri- or more polyvalent hydroxy compound, a pH adjusting agent, an additive, and a dispersing medium and having pH of less than 6.0,
 wherein the abrasive grains are cation-modified colloidal silica, and   the additive is at least one selected from the group consisting of antiseptic agents, antifungal agents, and water-soluble polymers.   
     
     
         20 . The polishing composition according to  claim 19 , wherein the tri- or more polyvalent hydroxy compound has a molecular weight of 90 or more. 
     
     
         21 . The polishing composition according to  claim 19 , wherein the tri- or more polyvalent hydroxy compound is a sugar alcohol. 
     
     
         22 . The polishing composition according to  claim 19 , wherein the pH is 2.0 or more and 5.5 or less. 
     
     
         23 . The polishing composition according to  claim 19 , wherein the silicon material has an oxygen atom and a silicon atom.