US2022412666A1PendingUtilityA1
Basic structural body for constructing heat dissipation device and heat dissipation device
Assignee: ASIA VITAL COMPONENTS CO LTDPriority: Dec 13, 2017Filed: Aug 28, 2022Published: Dec 29, 2022
Est. expiryDec 13, 2037(~11.4 yrs left)· nominal 20-yr term from priority
Inventors:Kuei-Feng Chiang
H10W 40/259H10W 40/258H10W 40/251H10W 40/73F28F 21/087F28D 15/0266C25D 7/00F28F 21/085C23C 24/08C23C 18/31F28F 21/04H05K 7/20336F28F 21/084C25D 1/00F28D 15/046F28F 21/086B23P 15/26F28D 15/0233F28D 15/06F28F 21/083F28D 15/043H01L 23/3731H01L 23/427B33Y 80/00F28F 21/065
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Claims
Abstract
A basic structural body for constructing heat dissipation device and a heat dissipation device are disclosed. The heat dissipation device includes a first basic structural body having a wick structure formed on one side surface thereof; and the first basic structural body and the wick structure are structural bodies formed layer by layer. Two pieces of first basic structural bodies can be correspondingly closed together to construct a heat dissipation device internally defining an airtight chamber. In this manner, the heat dissipation device can be designed in a more flexible manner.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A heat dissipation device, comprising:
a main body internally defining an airtight chamber, in which an intermediate body and a working fluid are provided; and the main body and the intermediate body being structural bodies formed layer by layer.
2 . The heat dissipation device as claimed in claim 1 , wherein the intermediate body is an integral structural body having a first side and an opposite second side, and a plurality of through holes and a recess structure; the recess structure being located on at least one of the first and the second side, and the through holes being extended through the intermediate body to communicate the first side with the second side; the recess structure and the through holes being optionally alternately arranged or not; and the main body and the intermediate body being in the form of a plate member.
3 . The heat dissipation device as claimed in claim 1 , wherein the main body and the intermediate body are formed using a material selected from the group consisting of gold, silver, copper, aluminum, titanium, stainless steel, ceramic, plastic, and any combination thereof.
4 . The heat dissipation device as claimed in claim 1 , further comprising a wick structure formed between the main body and the intermediate body; the wick structure being selected from the group consisting of a structural layer including one single porous body and a structural layer including a plurality of superimposed porous bodies; and the porous body being selected from the group consisting of a powder-sintered body, a woven mesh, a fibrous member, and a structural body combining superimposed layers of powder-sintered body, woven mesh and fibrous member.
5 . The heat dissipation device as claimed in claim 1 , wherein the intermediate body further includes a plurality of supporting structures, each of which is in the form of a post having two ends extended through and projected from the first side and the second side of the intermediate body.
6 . The heat dissipation device as claimed in claim 1 , wherein the intermediate body further includes a plurality of supporting structures, each of which includes a plurality of posts separately located on the first side and the second side of the intermediate body.
7 . A heat dissipation device, comprising:
a main body internally defining an airtight chamber and having a wick structure formed on inner wall surfaces of the airtight chamber and a working fluid filled in the airtight chamber; and the main body and the wick structure being structural bodies formed layer by layer.
8 . The heat dissipation device as claimed in claim 7 , wherein the main body and the wick structure are formed using a material selected from the group consisting of gold, silver, copper, aluminum, titanium, stainless steel, ceramic, non-metal materials, and any combination thereof.
9 . The heat dissipation device as claimed in claim 7 , wherein the wick structure is selected from the group consisting of a structural layer including one single porous body and a structural layer including a plurality of superimposed porous bodies, and is formed through a manner selected from the group consisting of 3 D printing, electroforming, electroplating, printing, and thermal spraying; and the porous body being selected from the group consisting of a powder-sintered body, a woven mesh, a fibrous member, and a structural body combining superimposed layers of powder-sintered body, woven mesh and fibrous member.Join the waitlist — get patent alerts
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