Etchant composition and methods for manufacturing metal pattern and array substrate using the same

Abstract

A method for manufacturing a metal pattern, the method including forming a photosensitive layer pattern on a multilayer metal substrate including titanium and copper; providing an etchant composition on the multilayer metal substrate on which the photosensitive layer pattern is formed to form the source electrode and the drain electrode; and removing the photosensitive layer pattern, wherein the etchant composition includes a persulfate, a four-nitrogen ring compound, a two-chlorine compound, a fluorine compound, and water, and a weight ratio of the four-nitrogen ring compound and the two-chlorine compound is from about 1:0.5 to about 1:4.

What is claimed is: 
     
         1 . A method for manufacturing a metal pattern, the method comprising:
 forming a photosensitive layer pattern on a multilayer comprising titanium and copper;   providing an etchant composition on the multilayer on which the photosensitive layer pattern is formed to form a multilayer metal pattern; and   removing the photosensitive layer pattern,   wherein the etchant composition comprises a persulfate, a four-nitrogen ring compound, a two-chlorine compound, a fluorine compound, and water, and a weight ratio of the four-nitrogen ring compound and the two-chlorine compound is from about 1:0.5 to about 1:4.   
     
     
         2 . The method for manufacturing a metal pattern of  claim 1 , wherein the multilayer comprises:
 a first metal layer comprising titanium; and   a second metal layer disposed on the first metal layer and comprising copper.   
     
     
         3 . The method for manufacturing a metal pattern of  claim 2 , wherein the etchant composition etches the first metal layer and the second metal layer in a batch process. 
     
     
         4 . The method for manufacturing a metal pattern of  claim 1 , wherein
 the etchant composition further comprises a hydrogen sulfate, a sulfonic acid compound, an antioxidant, an acidity regulator, a phosphate, and a copper salt, and   the etchant composition comprises, based on a total weight of the etchant composition:   from about 0.1 wt % to about 25 wt % of the persulfate;   from about 0.5 wt % to about 1 wt % of the four-nitrogen ring compound;   from about 0.5 wt % to about 2 wt % of the two-chlorine compound;   from about 0.01 wt % to about 3 wt % of the fluorine compound;   from about 0.05 wt % to about 8 wt % of the hydrogen sulfate;   from about 0.1 wt % to about 10 wt % of the sulfonic acid compound;   from about 0.001 wt % to about 3 wt % of the antioxidant;   from about 0.1 wt % to about 0.9 wt % of the acidity regulator;   from about 0.1 wt % to about 5 wt % of the phosphate;   from about 0.01 wt % to about 2 wt % of the copper salt; and   a remaining amount of the water.   
     
     
         5 . A method for manufacturing an array substrate, the method comprising:
 forming a gate line and a gate electrode which is connected with the gate line, on a substrate;   forming a data line which crosses the gate line in an insulated state, a source electrode which is connected with the data line, and a drain electrode which is separated from the source electrode; and   forming a pixel electrode which is connected with the drain electrode,   wherein the step of forming of the source electrode and the drain electrode which is separated from the source electrode comprises:   forming a photosensitive layer pattern on a multilayer comprising titanium and copper;   providing an etchant composition on the multilayer on which the photosensitive layer pattern is formed to form the source electrode and the drain electrode; and   removing the photosensitive layer pattern,   wherein the etchant composition comprises a persulfate, a four-nitrogen ring compound, a two-chlorine compound, a fluorine compound, and water, and a weight ratio of the four-nitrogen ring compound and the two-chlorine compound is from about 1:0.5 to about 1:4.   
     
     
         6 . The method for manufacturing an array substrate of  claim 5 , wherein
 the etchant composition further comprises a hydrogen sulfate, a sulfonic acid compound, an antioxidant, an acidity regulator, a phosphate, and a copper salt, and   the etchant composition comprises, based on a total weight of the etchant composition:   from about 0.1 wt % to about 25 wt % of the persulfate;   from about 0.5 wt % to about 1 wt % of the four-nitrogen ring compound;   from about 0.5 wt % to about 2 wt % of the two-chlorine compound;   from about 0.01 wt % to about 3 wt % of the fluorine compound;   from about 0.05 wt % to about 8 wt % of the hydrogen sulfate;   from about 0.1 wt % to about 10 wt % of the sulfonic acid compound;   from about 0.001 wt % to about 3 wt % of the antioxidant;   from about 0.1 wt % to about 0.9 wt % of the acidity regulator;   from about 0.1 wt % to about 5 wt % of the phosphate;   from about 0.01 wt % to about 2 wt % of the copper salt; and   a remaining amount of the water.