Plating apparatus and plating solution agitating method

Abstract

Provided is a plating apparatus and a plating solution agitating method that can agitate a plating solution without using a paddle.A plating apparatus 1000 includes a holder cover 50 disposed in a substrate holder 30 and configured to rotate with the substrate holder when the substrate holder rotates. The holder cover is configured to have a lower surface immersed in the plating solution with the lower surface positioned below a surface to be plated of a substrate. The lower surface of the holder cover is provided with at least one cover groove extending in a direction intersecting with a rotation direction of the holder cover.

1 . A plating apparatus comprising:
 a plating tank configured to store a plating solution, an anode being disposed in an inside of the plating tank;   a substrate holder disposed above the anode and configured to hold a substrate as a cathode;   a rotation mechanism configured to rotate the substrate holder; and   a holder cover disposed to the substrate holder and configured to rotate with the substrate holder when the substrate holder rotates, wherein   the holder cover is configured to have a lower surface immersed in the plating solution and positioned below a surface to be plated of the substrate, and   the lower surface of the holder cover is provided with at least one cover grove extending in a direction intersecting with a rotation direction of the holder cover.   
     
     
         2 . The plating apparatus according to  claim 1 , wherein
 the holder cover has a ring shape in a bottom view.   
     
     
         3 . The plating apparatus according to  claim 1 , further comprising
 a turbulence generating member disposed in a position below the substrate and above the anode in the inside of the plating tank, the turbulence generating member being configured to generate turbulence in the plating solution flowing from below the substrate toward the substrate.   
     
     
         4 . The plating apparatus according to  claim 3 , wherein
 the turbulence generating member has an internal flow passage configured to communicate a lower end of the turbulence generating member with an upper end of the turbulence generating member, and the plating solution heading toward the substrate flows through the internal flow passage, and   the internal flow passage in a bottom view of the turbulence generating member has an Archimedean spiral shape.   
     
     
         5 . The plating apparatus according to  claim 4 , wherein
 the internal flow passage is provided with a protrusion configured to generate the turbulence in the plating solution flowing through the internal flow passage.   
     
     
         6 . The plating apparatus according to  claim 4 , wherein
 the turbulence generating member is configured such that when a plating process is performed on the substrate, the upper end of the turbulence generating member has a clearance with the surface, to be plated of the substrate and is positioned above the lower surface of the holder cover.   
     
     
         7 . An agitating method of the plating solution of the plating apparatus according to  claim 1 , comprising
 rotating the substrate holder by the rotation mechanism with the lower surface of the holder cover immersed in the plating solution when the plating process is performed on the substrate.