Plating apparatus and plating processing method

Abstract

A plating module 400 includes a plating tank 410 , a substrate holder 440 , an elevating mechanism 480 , and a moving mechanism 490 . The plating tank 410 is for housing a plating solution. The substrate holder 440 is for holding a substrate Wf with a surface to be plated Wf-a facing the plating solution housed in the plating tank 410 . The elevating mechanism 480 is for elevating the substrate holder 440 . The moving mechanism 490 is for moving the substrate holder 440 in a direction perpendicular to an elevating direction of the substrate holder 440.

1 . A plating apparatus comprising:
 a plating tank for housing a plating solution;   a substrate holder for holding a substrate with a surface to be plated facing the plating solution housed in the plating tank;   an elevating mechanism for elevating the substrate holder; and   a moving mechanism for moving the substrate holder in a direction perpendicular to an elevating direction of the substrate holder.   
     
     
         2 . The plating apparatus according to  claim 1 , wherein
 the moving mechanism includes:
 a first moving mechanism for moving the substrate holder in a first direction perpendicular to the elevating direction; and 
 a second moving mechanism for moving the substrate holder in a second direction perpendicular to the elevating direction and the first direction. 
   
     
     
         3 . The plating apparatus according to  claim 2 , wherein
 the first moving mechanism includes a first linear guide extending in the first direction, a first support table disposed on the first linear guide, and a first driving member for moving the first support table along the first linear guide,   the second moving mechanism includes a second linear guide extending in the second direction, a second support table disposed on the second linear guide, and a second driving member for moving the second support table along the second linear guide,   the first moving mechanism and the second moving mechanism are disposed to be stacked on a base, and   the elevating mechanism includes an elevating linear guide and an elevating driving member, the elevating linear guide being mounted to the first support table or the second support table, and extending in the elevating direction, the elevating driving member being for moving a holding member holding the substrate holder along the elevating linear guide.   
     
     
         4 . The plating apparatus according to  claim 1 , wherein
 the moving mechanism moves the substrate holder such that a shaft center of an anode disposed inside the plating tank and a shaft center of the substrate held by the substrate holder are aligned.   
     
     
         5 . The plating apparatus according to  claim 1 , wherein
 the plating apparatus further comprises a sensor for measuring a plating film thickness formed on the surface to be plated of the substrate by the plating process, and   the moving mechanism is configured to move the substrate holder based on the plating film thickness measured by the sensor.   
     
     
         6 . The plating apparatus according to  claim 1 , comprising
 a plurality of plating modules each including the plating tank, the substrate holder, the elevating mechanism, and the moving mechanism.   
     
     
         7 . A plating processing method comprising:
 a moving step of moving a substrate holder for holding a substrate with a surface to be plated facing a plating solution housed in a plating tank in a direction perpendicular to an elevating direction of the substrate holder;   a lowering step of lowering the substrate holder into the plating tank; and   a plating step of performing a plating process on the substrate held by the substrate holder lowered into the plating tank.   
     
     
         8 . The plating processing method according to  claim 7 , wherein
 the moving step includes:
 a first moving step of moving the substrate holder in a first direction perpendicular to the elevating direction; and 
 a second moving step of moving the substrate holder in a second direction perpendicular to the elevating direction and the first direction. 
   
     
     
         9 . The plating processing method according to  claim 7 , wherein
 the moving step includes a first moving step of moving the substrate holder such that a shaft center of an anode disposed inside the plating tank and a shaft center of the substrate held by the substrate holder are aligned.   
     
     
         10 . The plating processing method according to  claim 7 , wherein
 the plating processing method further comprises a measuring step of measuring a plating film thickness formed on the surface to be plated of the substrate by the plating step, and   the moving step includes a second moving step of moving the substrate holder based on the plating film thickness measured by the measuring step.