Vaporization device

Abstract

The present application relates to a vaporization device. The proposed vaporization device includes a heating component top cap, a heating component base, and a heating component disposed between the heating component top cap and the heating component base. The heating component includes a first part and a second part, the first part including a first material, and the second part including a second material, the first material is different from the second material.

What is claimed is: 
     
         1 . A vaporization device, comprising:
 a heating component top cap;   a heating component base; and   a heating component disposed between the heating component top cap and the heating component base, wherein   the heating component comprises a first part and a second part, the first part comprising a first material, and the second part comprising a second material, the first material is different from the second material.   
     
     
         2 . The vaporization device according to  claim 1 , wherein the first material comprises zirconium oxide, and the second material comprises silicon oxide. 
     
     
         3 . The vaporization device according to  claim 1 , wherein the first material comprises a mixture of zirconium oxide, silicon oxide, or aluminum oxide. 
     
     
         4 . The vaporization device according to  claim 1 , wherein a compressive strength of the first material is greater than a compressive strength of the second material. 
     
     
         5 . The vaporization device according to  claim 1 , wherein a thermal conductivity coefficient of the first material is greater than a thermal conductivity coefficient of the second material. 
     
     
         6 . The vaporization device according to  claim 1 , wherein the heating component further comprises a heating circuit disposed on a surface of the second part. 
     
     
         7 . The vaporization device according to  claim 1 , wherein a thickness of the first part is greater than a thickness of the second part. 
     
     
         8 . The vaporization device according to  claim 1 , wherein the first part covers a first surface, a second surface, and a third surface of the second part. 
     
     
         9 . The vaporization device according to  claim 1 , wherein a thermal conductivity coefficient of the heating component is in a range of 0.12 W/(mK) to 2.6 W/(mK). 
     
     
         10 . The vaporization device according to  claim 1 , wherein a compressive strength of the first part is greater than 10 Mpa. 
     
     
         11 . The vaporization device according to  claim 1 , wherein the heating component further comprises a heating circuit that is wound around the heating component. 
     
     
         12 . A vaporization device, comprising:
 a heating component top cap;   a heating component base; and   a heating component disposed between the heating component top cap and the heating component base, wherein   the heating component comprises a heating circuit, a first part, and a second part, the first part comprising a first material, and the second part comprising a second material, wherein a thermal conductivity coefficient of the first material is different from a thermal conductivity coefficient of the second material.   
     
     
         13 . The vaporization device according to  claim 12 , the heating component further comprising a groove, wherein the first part covers a first surface and a second surface of the second part, and the first part exposes a first surface and a second surface of the groove. 
     
     
         14 . The vaporization device according to  claim 12 , wherein the heating component comprises a plurality of pores, a porosity of the heating component being in a range of 35% to 95%. 
     
     
         15 . The vaporization device according to  claim 14 , wherein the plurality of pores include open pores and closed pores, an open porosity of the heating component being in a range of 30% to 60%, and a closed porosity of the heating component being in a range of 5% to 35%. 
     
     
         16 . The vaporization device according to  claim 12 , wherein the heating circuit is in direct contact with the second part, a compressive strength of the second part being smaller than a compressive strength of the first part. 
     
     
         17 . The vaporization device according to  claim 12 , wherein a thermal conductivity coefficient of the heating component is in a range of 0.1 W/(mK) to 10 W/(mK). 
     
     
         18 . The vaporization device according to  claim 12 , wherein a thickness of the first part is different from a thickness of the second part. 
     
     
         19 . The vaporization device according to  claim 12 , wherein the second material comprises a mixture of zirconium oxide, silicon oxide, or aluminum oxide. 
     
     
         20 . The vaporization device according to  claim 12 , wherein the first part covers a first surface, a second surface, and a third surface of the second part.