Printed circuit board and electronic device comprising the same

Abstract

The present disclosure relates to a printed circuit and an electronic device including the same. The printed circuit board includes a first substrate having a through portion, a second substrate disposed in the through portion of the first substrate, and in which at least a portion of a side surface thereof is surrounded by the first substrate, and a flexible substrate disposed in the through portion of the first substrate and connecting the first and second substrates.

What is claimed is: 
     
         1 . A printed circuit board, comprising:
 a first substrate having a through portion;   a second substrate disposed in the through portion of the first substrate, at least a portion of a side surface of the second substrate being surrounded by the first substrate; and   a flexible substrate disposed in the through portion of the first substrate, and connecting the first and second substrates,   wherein at least one of the first and second substrates has a different insulating material from an insulating material of the flexible substrate.   
     
     
         2 . The printed circuit board of  claim 1 , wherein the flexible substrate has one side connected to a wall surface of the through portion of the first substrate, and has the other side connected to the side surface of the second substrate. 
     
     
         3 . The printed circuit board of  claim 1 , wherein another portion of the side surface of the second substrate is exposed from the first substrate. 
     
     
         4 . The printed circuit board of  claim 3 , wherein an area of the portion of the side surface of the second substrate surrounded by the first substrate is greater than an area of the another portion of the side surface of the second substrate exposed from the first substrate. 
     
     
         5 . The printed circuit board of  claim 1 , wherein all side surfaces of the second substrate are surrounded by the first substrate. 
     
     
         6 . The printed circuit board of  claim 1 , wherein the through portion of the first substrate has a shape corresponding substantially to a shape of the second substrate, on a plane. 
     
     
         7 . The printed circuit board of  claim 1 , wherein the through portion is blocked by the first substrate in at least three directions of first to fourth directions, perpendicular to each other or parallel to each other, but facing different directions, on a plane. 
     
     
         8 . The printed circuit board of  claim 7 , wherein the through portion is exposed from the first substrate in any one direction of the first to fourth directions. 
     
     
         9 . The printed circuit board of  claim 7 , wherein the through portion is blocked by the first substrate in all of the first to fourth directions. 
     
     
         10 . A printed circuit board, comprising:
 a first substrate having a through portion;   a second substrate;   a flexible substrate extending from an edge of the through portion and connected to the second substrate,   wherein the second substrate is rotatable along the flexible substrate between a first position in which the second substrate is disposed in the through portion and a second position in which the second substrate overlaps the first substrate, and   wherein the flexible substrate is separately formed from the first and second substrates and is comprised of an insulating layer.   
     
     
         11 . The printed circuit board of claim  18 , further comprising:
 a first connector disposed on one surface of the first substrate; and   a second connector disposed on one surface of the second substrate,   wherein the first and second substrates are connected to each other through the first and second connectors being in contact with each other in the second position.   
     
     
         12 . The printed circuit board of claim  18 , wherein the through portion of the first substrate has a shape corresponding substantially to a shape of the second substrate. 
     
     
         13 . The printed circuit board of claim  19 , wherein the first and second connectors are spaced from each other by the flexible substrate in the first position.