US2022384452A1PendingUtilityA1
Integrated Memory Comprising Gated Regions Between Charge-Storage Devices and Access Devices
Est. expiryAug 10, 2038(~12 yrs left)· nominal 20-yr term from priority
G11C 5/025G11C 11/407H01L 27/10897H01L 27/10814H10D 64/519H10D 64/111H10D 62/116H10D 30/6728H10D 30/603H10D 62/151H10B 12/0335H10B 12/315H10B 12/50
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Claims
Abstract
Some embodiments include an integrated assembly having an access transistor. The access transistor has a first source/drain region gatedly coupled with a second source/drain region. A digit line is coupled with the first source/drain region. A charge-storage device is coupled with the second source/drain region through an interconnect. The interconnect includes a length of a semiconductor material. A protective transistor gates a portion of the length of the semiconductor material.
Claims
exact text as granted — not AI-modified1 - 18 . (canceled)
19 . An integrated assembly, comprising:
a first transistor comprising a first gate and a source/drain region; an interconnect extending from the source/drain region to a charge-storage device; and a second transistor comprising a second gate that gates a portion of a length of the interconnect, the second gate electrically coupled to the first gate.
20 . The integrated assembly of claim 19 wherein the charge-storage device comprises a capacitor.
21 . The integrated assembly of claim 20 wherein the capacitor comprises an upper node that is not configured as an upwardly-opening container.
22 . The integrated assembly of claim 20 wherein the capacitor comprises an insulative material configured an upwardly-opening container and an upper node filling an entirety of the upwardly-opening container.
23 . The integrated assembly of claim 19 wherein the interconnect does not extend vertically.
24 . The integrated assembly of claim 19 wherein the interconnect comprises a first material over a second material, the second material being different form the first material.
25 . An integrated assembly, comprising:
a first transistor comprising a source/drain region; an interconnect extending from the source/drain region and comprising at least:
one or more of metals;
a metal-containing material; or
conductively-doped germanium; and
a second transistor comprising a gate that gates a portion of the length of the interconnect.
26 . The integrated assembly of claim 25 wherein the first transistor comprises a first gate and the gate of the second transistor comprises a second gate, the first gate is electrically coupled to the second gate.
27 . The integrated assembly of claim 25 wherein the one or more of metals comprises titanium, tungsten, cobalt, nickel, platinum or ruthenium.
28 . The integrated assembly of claim 25 wherein the metal-containing material comprises metal silicide, metal nitride or metal carbide.
29 . The integrated assembly of claim 25 wherein the interconnect comprises conductively-doped germanium and at least:
one or more of metals; or
a metal-containing material.
30 . An integrated assembly, comprising:
a first transistor comprising a first gate and a source/drain region; an interconnect comprising a first material and a second material different from the first material, the first material extending from the source/drain region; and a second transistor comprising a second gate that gates a portion of the interconnect at the second material.
31 . The integrated assembly of claim 30 wherein the first gate is electrically coupled to the second gate.
32 . The integrated assembly of claim 30 wherein the second material of the interconnect comprises conductively-doped germanium.
33 . The integrated assembly of claim 30 wherein the first material of the interconnect comprises at least:
one or more of metals; or
a metal-containing material.
34 . The integrated assembly of claim 30 wherein the second material of the interconnect comprises semiconductor material and the first material comprises at least:
one or more of metals; or
a metal-containing material.Join the waitlist — get patent alerts
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