Vapor deposition apparatus

Abstract

A vapor deposition apparatus for providing a deposition film on a substrate, the vapor deposition apparatus includes a plurality of first nozzle parts which injects a first raw material toward the substrate; a plurality of second nozzle parts which is alternately disposed together with the plurality of first nozzle parts and injects a second raw material toward the substrate; a diffuser unit which distributes the second raw material to the plurality of second nozzle parts; and a supply unit which supplies the second raw material to the diffuser unit.

What is claimed is: 
     
         1 . A vapor deposition apparatus comprising:
 a plurality of first nozzles which inject a first raw material toward a substrate;   a plurality of second nozzles which is alternately disposed with the plurality of first nozzles and inject a second raw material, in a radical form having a neutral polarity, toward the substrate;   a diffuser which distributes the second raw material, in a radical form having a neutral polarity, to the plurality of second nozzle; and   a supply unit which comprises a plasma generator and supplies the second raw material, in a radical form having a neutral polarity, to the diffuser,   wherein the diffuser comprises:   an upper plate connected to the supply unit and comprising an opening through which the second raw material, in a radical form having a neutral polarity, supplied from the supply unit;   a lower plate disposed opposite the upper plate and disposed nearer to the second nozzle than the upper plate; and   at least one distribution plate disposed between the upper plate and the lower plate, the distribution plate being electrified and having a plurality of holes through which the second raw material, in a radical form having a neutral polarity, passes.   
     
     
         2 . The vapor deposition apparatus of  claim 1 , wherein the opening passes through the upper plate in a first direction intersecting the upper plate, and
 wherein the plurality of holes pass through the distribution plate in the first direction.   
     
     
         3 . The vapor deposition apparatus of  claim 2 , wherein the plurality of second nozzles inject the second raw material passing through the opening and the plurality of holes toward the substrate in the first direction. 
     
     
         4 . The vapor deposition apparatus of  claim 1 , wherein the at least one distribution plates is detachably coupled to the diffuser. 
     
     
         5 . The vapor deposition apparatus of  claim 1 , further comprising an exhaust unit disposed between a first nozzle and a second nozzle adjacent to each other among the plurality of first nozzles and the plurality of second nozzles. 
     
     
         6 . The vapor deposition apparatus of  claim 1 , wherein the at least one distribution plate comprises a first distribution plate and a second distribution plate on the first distribution plate,
 wherein the first distribution plate and the second distribution plate are arranged parallel to each other, and   wherein a number of first holes defined in a first distribution plate is greater than a number of second holes defined in a second distribution plate.   
     
     
         7 . The vapor deposition apparatus of  claim 6 , wherein a size of each of the first holes is larger than a size of each of the second holes. 
     
     
         8 . The vapor deposition apparatus of  claim 6 , wherein an entire area of the first holes is larger than an entire of the second holes. 
     
     
         9 . The vapor deposition apparatus of  claim 1 , further comprising a driving stage for transferring the substrate,
 wherein the driving stage moves relative to the vapor deposition apparatus.