Rotational removal of electronic chips and other components from printed wire boards using liquid heat media

Abstract

Systems and methods for the removal of electronic chips and other components from PWBs using liquid heat media are generally described. According to certain embodiments, PWBs comprising solder can be positioned within a rotatable housing. The rotatable housing can, in some embodiments, be at least partially immersed within a liquid heat medium. The liquid heat medium can be heated and/or maintained at a temperature sufficiently high to melt the solder. In some embodiments, the rotatable housing can be rotated while it is at least partially immersed in the liquid heat medium. The rotational force can aid, according to some embodiments, in the removal of solder, electronic chips (including those in which an integrated circuit is positioned on a piece of semiconductor material, such as silicon), and/or other electronic components attached to one or more surfaces of the PWB.

1 . A process for the removal of electronic components attached to a surface of a printed wire board (PWB) with solder, comprising:
 immersing a rotatable housing containing the PWB at least partially into a liquid heat medium within a heating vessel at a temperature higher than the melting temperature of the solder such that the solder melts, and   rotating the rotatable housing.   
     
     
         2 - 47 . (canceled) 
     
     
         48 . The process of  claim 1 , wherein a rotational axis of the rotatable housing is oriented horizontally. 
     
     
         49 . The process of  claim 1 , further comprising separating at least a portion of the solder from the liquid heat medium by cooling the liquid heat medium containing the molten solder down to a temperature lower than a melting temperature of the solder. 
     
     
         50 . The process of  claim 49 , wherein the solder is at least partially separated from the liquid heat medium by cold filtration. 
     
     
         51 . The process of  claim 49 , further comprising recirculating the liquid heat medium to the heating vessel. 
     
     
         52 . The process of  claim 1 , further comprising recovering one or more metals from the removed electronic components and/or the printed wire board (PWB). 
     
     
         53 . The process of  claim 52 , wherein the one or more metals comprise copper, aluminum, and/or precious metals. 
     
     
         54 . The process of  claim 1 , wherein the rotatable housing rotates while exposing the printed wire board to the liquid heat medium. 
     
     
         55 . The process of  claim 1 , wherein the liquid heat medium comprises a polymeric organosilicon compound and/or a silicone oil. 
     
     
         56 . The process of  claim 1 , wherein the rotatable housing rotates in multiple directions. 
     
     
         57 . The process of  claim 1 , wherein the electronic components and/or solder are collected by one or more screens associated with the rotatable housing. 
     
     
         58 . The process of  claim 1 , wherein the heating vessel has a bottom having a tapered shape. 
     
     
         59 . The process of  claim 1 , wherein a vapor collection unit associated with the heating vessel is configured collects vapors of the liquid heat medium from the rotatable housing. 
     
     
         60 . The process of  claim 59 , wherein the vapor collection unit comprises an exhaust vent and/or a trap that condenses vapors of the liquid heat medium. 
     
     
         61 . The process of  claim 1 , wherein upon removal of the electronic components from the printed wire board, the printed wire board is in the form of a bare board. 
     
     
         62 . The process of  claim 61 , further comprising transporting air across a surface of the bare board to remove residual liquid heat medium. 
     
     
         63 . The process of  claim 62 , wherein hot air is transported across the surface of the bare board. 
     
     
         64 . The process of  claim 61 , further comprising spraying the bare board with a cleaning liquid. 
     
     
         65 . The process of  claim 61 , further comprising rinsing the bare board and/or the removed electronic components with water, wherein residual liquid heat medium from the bare board and/or the electronic components is recycled from the rinse water to the heating vessel. 
     
     
         66 . The process of  claim 1 , wherein the heating vessel comprises a conveyer configured to transport the removed electronic components out of the heating vessel.