System and method for high-temperature lamination of printed circuit boards

Abstract

A press pad for use in lamination of multi-layer circuit boards is disclosed. The press pad includes: a planar pad having a first surface and a second surface opposite to the first surface; and a sheet of release film coupled to the first surface, wherein the release film sheet is coupled to the first surface using an acrylic-based adhesive containing thermoplastic polyolefin and methyl acrylate, and wherein the release film sheet comprises polyimide-based film.

1 . A press pad for use in lamination of multi-layer circuit boards, the press pad comprising:
 a planar pad having a first surface and a second surface opposite to the first surface; and   a sheet of release film coupled to the first surface,   
       wherein the release film sheet is coupled to the first surface using an acrylic-based adhesive containing thermoplastic polyolefin and methyl acrylate, and wherein the release film sheet comprises polyimide-based film. 
     
     
         2 . The press pad of  claim 1 , wherein the planar pad is constructed of at least one of paper or cotton. 
     
     
         3 . The press pad of  claim 1 , wherein a thickness of each release film sheet is between 0.003 and 0.01 inch. 
     
     
         4 . The press pad of  claim 1 , wherein the acrylic-based adhesive forms an adhesive layer coupling the release film sheet to the first surface, and wherein a thickness of the adhesive layer is between 5 and 15 microns. 
     
     
         5 . The press pad of  claim 1 , wherein a thickness of the planar pad is between 0.05 and 0.06 inch. 
     
     
         6 . The press pad of  claim 1 , wherein the release film sheet comprises a polyimide-based film containing polytetrafluoroethylene filler particles.