Package structure with fan-out structure

Abstract

A package structure is provided. The package structure includes a first redistribution structure and a second redistribution structure over the first redistribution structure. The package structure also includes. The package structure further includes a semiconductor chip between the first redistribution structure and the second redistribution structure. In addition, the package structure includes a protective layer surrounding the semiconductor chip and a conductive structure penetrating through the protective layer. The conductive structure has a solder element and a conductive pillar, the conductive pillar has a first end and a second end, and the first end is between the second end and the solder element. The solder element has a protruding portion extending from an interface between the conductive pillar and the solder element towards the second end. A terminal of the protruding portion is vertically between the first end and the second end.

What is claimed is: 
     
         1 . A package structure, comprising:
 a first redistribution structure;   a second redistribution structure over the first redistribution structure;   a semiconductor chip between the first redistribution structure and the second redistribution structure;   a protective layer surrounding the semiconductor chip; and   a conductive structure penetrating through the protective layer, wherein the conductive structure comprises a solder element and a conductive pillar, the conductive pillar has a first end and a second end, the first end is between the second end and the solder element, the solder element has a protruding portion extending from an interface between the conductive pillar and the solder element towards the second end, and a terminal of the protruding portion is vertically between the first end and the second end.   
     
     
         2 . The package structure as claimed in  claim 1 , wherein the protruding portion of the solder element has an inner sidewall, and the inner sidewall and a sidewall of the conductive pillar define an acute angle. 
     
     
         3 . The package structure as claimed in  claim 1 , wherein the protruding portion of the solder element laterally and partially surrounds of a sidewall of the conductive pillar. 
     
     
         4 . The package structure as claimed in  claim 1 , wherein the solder element has a first side surface extending into the second redistribution structure, the solder element has a second side surface extending along a bottom surface of the second redistribution structure, the first side surface and the second side surface define an angle, and the angle is in a range from about 90 degrees to about 140 degrees. 
     
     
         5 . The package structure as claimed in  claim 1 , further comprising:
 connectors between the semiconductor chip and the first redistribution structure; and   an underfill layer between the connectors and the protective layer.   
     
     
         6 . The package structure as claimed in  claim 5 , wherein the conductive pillar is between the first redistribution structure and the solder element. 
     
     
         7 . The package structure as claimed in  claim 5 , wherein the interface between the conductive pillar and the solder element is vertically between a top surface of the semiconductor chip and a bottom surface of the semiconductor chip. 
     
     
         8 . The package structure as claimed in  claim 1 , wherein a portion of the protective layer is between the protruding portion of the solder element and the conductive pillar. 
     
     
         9 . The package structure as claimed in  claim 1 , wherein the protective layer laterally surrounds the protruding portion of the solder element. 
     
     
         10 . The package structure as claimed in  claim 1 , wherein the protruding portion of the solder element continuously surrounds the conductive pillar. 
     
     
         11 . A package structure, comprising:
 a first redistribution structure;   a second redistribution structure over the first redistribution structure;   a semiconductor chip between the first redistribution structure and the second redistribution structure;   a conductive pillar bonded with the first redistribution structure;   a solder element bonded with the second redistribution structure, wherein the solder element has a protruding portion extending towards the first redistribution structure and extending across an end of the conductive pillar; and   a protective layer surrounding the semiconductor chip, the solder element, and the conductive pillar, wherein the protective layer fills a recess between the protruding portion of the solder element and the conductive pillar.   
     
     
         12 . The package structure as claimed in  claim 11 , wherein a portion of the protective layer is between the protruding portion of the solder element and the first redistribution structure. 
     
     
         13 . The package structure as claimed in  claim 11 , wherein the conductive pillar is closer to the first redistribution structure than the solder element. 
     
     
         14 . The package structure as claimed in  claim 11 , wherein the protruding portion of the solder element has an inner sidewall, and the inner sidewall and a sidewall of the conductive pillar define an acute angle. 
     
     
         15 . The package structure as claimed in  claim 11 , wherein the protective layer is in direct contact with the solder element and the conductive pillar. 
     
     
         16 . A package structure, comprising:
 a first redistribution structure;   a second redistribution structure over the first redistribution structure;   a semiconductor chip between the first redistribution structure and the second redistribution structure;   a conductive pillar bonded with the first redistribution structure; and   a solder element bonded with the second redistribution structure, wherein the solder element has a protruding portion extending towards the first redistribution structure to exceed an end of the conductive pillar and, and the conductive pillar is closer to the first redistribution structure than the solder element.   
     
     
         17 . The package structure as claimed in  claim 16 , further comprising a protective layer surrounding the semiconductor chip, wherein a portion of the protective layer is between the conductive pillar and the protruding portion of the solder element. 
     
     
         18 . The package structure as claimed in  claim 17 , wherein the protective layer is in direct contact with the protruding portion of the solder element. 
     
     
         19 . The package structure as claimed in  claim 16 , wherein the semiconductor chip is bonded with the first redistribution structure. 
     
     
         20 . The package structure as claimed in  claim 16 , wherein the protruding portion of the solder element has an inner sidewall, and the inner sidewall and a sidewall of the conductive pillar define an acute angle.