Flexible circuit design for monitoring physical bodies

Abstract

A flexible circuit may be provided that allows for the monitoring of a physical object. The flexible circuit includes a plurality of flexible conductive segments that are disposed in a geometric pattern. The flexible conductive segments include nodes, and the physical object is monitored by analyzing changes in electrical resistance in the conductive segments between the nodes. The flexible circuit may also include sensors disposed on the nodes for monitoring additional conditions. A processor monitors the flexible conductive segments and sensors. and may provide an output regarding the status of the physical object.

What is claimed is: 
     
         1 . A method of manufacturing a flexible circuit module, comprising:
 providing an electrically insulating substrate;   positioning a conductive layer on the substrate, wherein the conductive layer comprises at least two conductive elements positioned along a path between a first node and a second node in the conductive layer, wherein the first node and the second node are located at different positions on the substrate, wherein the at least two conductive elements are electrically coupled to the first node and the second node, and wherein the at least two conductive elements are electrically insulated from each other along the path between the first node and the second node; and   placing an electrically insulating top layer over the conductive layer on the substrate.   
     
     
         2 . The method of  claim 1 , further comprising locating the first node and the second node at vertices of a geometric shape. 
     
     
         3 . The method of  claim 1 , wherein at least a portion of the electrically insulating top layer is positioned between the at least two conductive elements. 
     
     
         4 . The method of  claim 1 , wherein the at least two conductive elements comprise a first conductive element and a second conductive element, and wherein the first conductive element defines a positive current pathway between the first node and the second node and the second conductive element defines a negative current pathway between the first node and the second node. 
     
     
         5 . The method of  claim 1 , wherein the at least two conductive elements comprise parallel elements along the path between the first node and the second node. 
     
     
         6 . The method of  claim 1 , wherein the at least two conductive elements comprise substantially flat, conductive wires made of conductive polymer. 
     
     
         7 . The method of  claim 1 , wherein the at least two conductive elements are configured to provide power-line communication between the first node and the second node. 
     
     
         8 . The method of  claim 1 , wherein the at least two conductive elements are configured to transmit both power and data between the first node and the second node. 
     
     
         9 . The method of  claim 1 , further comprising positioning a sensor at the first node. 
     
     
         10 . The method of  claim 1 , further comprising:
 providing a third node, wherein the conductive layer comprises at least two additional conductive elements positioned along a second path and coupled between the first node and a third node in the conductive layer;   the at least two additional conductive elements being electrically insulated from each other along the second path between the first node and the third node.   
     
     
         11 . The method of  claim 1 , wherein the nodes are configured to receive electrical signals from the conductive elements. 
     
     
         12 . The method of  claim 1 , further comprising providing a processor, the processor being configured to assess electrical signals in the conductive layer. 
     
     
         13 . The method of  claim 12 , wherein the processor is configured to assess changes in electrical properties of the conductive layer from the assessed electrical signals. 
     
     
         14 . The method of  claim 1 , wherein the flexible circuit module is electrically connected to another flexible circuit module. 
     
     
         15 . A method of manufacturing a flexible circuit, comprising:
 providing at least three nodes;   connecting each of the nodes with conductive elements such that the nodes and the conductive elements form a geometric shape, wherein the conductive elements pass electronic signals between the nodes; and   providing a processor, the processor configured to monitor the electronic signals passed between the nodes.   
     
     
         16 . The method of  claim 15 , further comprising disposing a sensor on at least one of the nodes. 
     
     
         17 . The method of  claim 15 , wherein the geometric shape formed by the nodes and the conductive elements is three-dimensional. 
     
     
         18 . The method of  claim 15 , wherein the geometric shape formed by the nodes and the conductive elements is three-dimensional. 
     
     
         19 . The method of  claim 15 , wherein the conductive elements are comprised of a metal rubber. 
     
     
         20 . The method of  claim 15 , further comprising:
 disposing the conductive elements and the nodes between a non-conductive bottom layer and a non-conductive top layer.