Transfer mold

Abstract

A transfer mold comprises a substrate having one or more fine concave portions formed on a surface thereof. At least one of a sidewall and a bottom of each fine concave portion has an oscillation waveform satisfying at least one of the following oscillation waveform conditions: (1) the oscillation waveform is continuous; (2) the oscillation waveform is a composite waveform of a plurality of oscillation waveforms, and the plurality of oscillation waveforms are in phase with each other; (3) fine concave portions of a plurality of rows are formed on the substrate, and oscillation waveforms of adjacent fine concave portions are in phase with each other; and (4) fine concave portions of a plurality of rows are formed on the substrate, and oscillation waveforms of the fine concave portions are in phase with each other for every two pitches.

1 . A transfer mold comprising
 a substrate having one or more fine concave portions formed on a surface thereof,   wherein at least one of a sidewall and a bottom of each fine concave portion has an oscillation waveform satisfying at least one of:   an oscillation waveform condition (1) that the oscillation waveform is continuous;   an oscillation waveform condition (2) that the oscillation waveform is a composite waveform of a plurality of oscillation waveforms, and the plurality of oscillation waveforms are in phase with each other;   an oscillation waveform condition (3) that fine concave portions of a plurality of rows are formed on the substrate, and oscillation waveforms of adjacent fine concave portions are in phase with each other; and   an oscillation waveform condition (4) that fine concave portions of a plurality of rows are formed on the substrate, and oscillation waveforms of the fine concave portions are in phase with each other for every two pitches.   
     
     
         2 . The transfer mold according to  claim 1 , wherein the substrate has a columnar or cylindrical shape.