US2022312655A1PendingUtilityA1

Method for manufacturing electromagnetic shielding film

Assignee: QING DING PREC ELECTRONICS HUAIAN CO LTDPriority: Apr 12, 2018Filed: Mar 2, 2022Published: Sep 29, 2022
Est. expiryApr 12, 2038(~11.7 yrs left)· nominal 20-yr term from priority
B32B 27/281H05K 9/0088B32B 2307/54C09J 2479/086B32B 7/12B32B 2255/10B32B 2307/212B32B 2255/205C09J 9/02B32B 2255/28H05K 1/0218C08K 2003/085H05K 1/0216H05K 2201/035C09J 2301/122B32B 2307/748B32B 27/34H05K 2201/0715H05K 9/0084B32B 27/065C08L 2205/025H05K 2201/0154C09J 163/00B32B 7/06B32B 2307/732B32B 2457/08C09J 2301/314C09J 7/29B32B 2307/7265C08K 2003/0806
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Claims

Abstract

A method for manufacturing an electromagnetic shielding film comprising providing an insulating layer, wherein the insulating layer is metallized to obtain a silver layer; and painting a conductive adhesive on a surface of the silver layer to form a conductive adhesive layer. The conductive adhesive layer comprises bisphenol A diglycidyl ether with a mass percentage between 9.8% and 10.5%, bisphenol S diglycidyl ether with a mass percentage between 4.54% and 4.86%, bisphenol F diglycidyl ether with a mass percentage between 2.27% and 2.43%, polyamide with a mass percentage between 7.11% and 7.62%, silver copper powder with a mass percentage between 48.6% and 68.3%, and silver strips with a mass percentage between 6.44% and 25.9%.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A method of manufacturing an electromagnetic shielding film, comprising:
 providing an insulating layer, wherein the insulating layer is metallized to obtain a silver layer;   painting a conductive adhesive on a surface of the silver layer to form a conductive adhesive layer;   wherein the conductive adhesive layer comprises bisphenol A diglycidyl ether with a mass percentage between 9.8% and 10.5%, bisphenol S diglycidyl ether with a mass percentage between 4.54% and 4.86%, bisphenol F diglycidyl ether with a mass percentage between 2.27% and 2.43%, polyamide with a mass percentage between 7.11% and 7.62%, silver copper powder with a mass percentage between 48.6% and 68.3%, and silver strips with a mass percentage between 6.44% and 25.9%; and   wherein the sum of the mass percentages is 100%.   
     
     
         2 . The method of  claim 1 , further comprising:
 metallizing a copper layer on the surface of the silver layer to form a metal thick layer, after the step of forming the silver layer and before the step of forming the conductive adhesive layer.   
     
     
         3 . The method of  claim 1 , wherein a silverized reagent of the silver layer is silver nanocrystals, and a main catalyst is nanosilver. 
     
     
         4 . The method of  claim 3 , wherein the silverized reagent is silver ion, and the main catalyst comprises AgNO 3 , Ag(NH 3 ) 2 NO 3 , AgClO 4 , and AgOAc.

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