Multilayer electronic component production method

Abstract

A sintered body that includes semiconductor ceramic layers and an internal electrode which are alternately stacked on one another is prepared. A first external electrode is formed on a side surface of the sintered body such that the first external electrode is connected to the internal electrode. An insulating layer is formed on a surface of the sintered body by applying a glass coating over an entire of the sintered body having the formed first external electrode. The insulating layer is exposed from the first external electrode. A second external electrode is formed on the first external electrode. This method provides the produced multilayer electronic component with a stable electric connection between the internal electrodes and the external electrodes.

1 . A method of producing a multilayer electronic component, comprising:
 providing a sintered body including an internal electrode therein;   forming a first external electrode on a side surface of the sintered body by a printing method;   forming a second external electrode on the first external electrode by a printing method; and   connecting a lead terminal with a plate shape to the second external electrode.   
     
     
         2 . A multilayer electronic component configured to be mounted to the mounting body, the multilayer electronic component comprising:
 an individual component including:
 a sintered body including an internal electrode provided therein, and 
 an external electrode provided on a side surface of the sintered body, the first external electrode being connected to the internal electrode, the first external electrode containing silver and not containing glass frit; 
   a bonding layer provided on the external electrode; and   a lead terminal connected to the external terminal via the bonding layer, second external electrode provided on the first external electrode via the insulating layer, the second external electrode having a plate shape, wherein:   the individual component has a mount surface facing the mounting body while the multilayer electronic component is mounted to the mounting body, and   while the multilayer electronic component is mounted to the mounting body, the bonding layer expands beyond the mount surface along the lead terminal from the external electrode.   
     
     
         3 . The multilayer electronic component of  claim 2 , wherein the bonding layer contains solder. 
     
     
         4 . The multilayer electronic component of  claim 2 , wherein the lead terminal is bent to have an L-shape.