Control of texture and morphology of zinc films through pulsed methods from additive-free electrolytes

Abstract

Various aspects according to the instant disclosure relate to a method of electrodeposition of zinc. The method includes independently controlling at least one of an electrical peak current and a duty cycle. The method further includes depositing the zinc on a substrate.

1 . A method of electrodeposition of zinc, the method comprising:
 independently controlling at least one of an electrical peak current and a duty cycle; and   depositing the zinc on a substrate to form a zinc layer.   
     
     
         2 . The method of  claim 1 , wherein the electrical peak current has a density is in a range of from about 32 mA/cm 2  to 156 A/cm 2 . 
     
     
         3 . The method of  claim 2 , wherein the electrical peak current has a density is in a range of from about 0.02 A/cm 2  to 1.5 A/cm 2 . 
     
     
         4 . The method of  claim 1 , wherein the duty cycle is in a range of from about 0.1% to about 50%. 
     
     
         5 . The method of  claim 4 , wherein the duty cycle is in a range of from about 2% to about 90%. 
     
     
         6 . The method of  claim 1 , wherein the electrical peak current has a density in a range of from about 0.02 A/cm 2  to 1.5 A/cm 2  and the duty cycle is in a range of from about 2% to about 10%. 
     
     
         7 . The method of  claim 1 , wherein the electrical peak current has a density in a range of from about 0.02 A/cm 2  to 0.5 A/cm 2  and the duty cycle is in a range of from about 5% to about 10%. 
     
     
         8 . The method of  claim 1 , wherein the zinc is present in a plating bath solution that is free of any additives. 
     
     
         9 . The method of  claim 1 , wherein the steel comprises stainless steel, carbon steel, or a combination thereof. 
     
     
         10 . The method of  claim 1 , wherein at least one of the electrical peak current and the duty cycle are independently controlled such that the zinc layer comprises a plurality of needle-shaped structures, hexagonal-plate structures, or a mixture thereof. 
     
     
         11 . A method of electrodeposition of zinc, the method comprising:
 independently controlling at least one of an electrical peak current and a duty cycle wherein the electrical peak current has a density in a range of from about 0.02 A/cm 2  to 1.5 A/cm 2  and the duty cycle is in a range of from about 2% to about 10%; and   depositing the zinc on a substrate, wherein the zinc layer comprises a plurality of needle-shaped structures, hexagonal-plate structures, or a mixture thereof.   
     
     
         12 . An assembly comprising:
 a steel substrate; and   a zinc layer deposited about the steel substrate, wherein the zinc layer comprises a plurality of needle-shaped structures, hexagonal-plate structures, or a mixture thereof.   
     
     
         13 . The assembly of  claim 12 , wherein the steel substrate comprises stainless steel, carbon steel, or a combination thereof. 
     
     
         14 . The assembly of  claim 12 , wherein the steel substrate is substantially planar. 
     
     
         15 . The assembly of  claim 12 , wherein the zinc layer comprises a plurality of needle-shaped structures. 
     
     
         16 . The assembly of  claim 12 , wherein the zinc layer comprises a plurality of hexagonal-plate structures. 
     
     
         17 . The assembly of  claim 12 , wherein the plurality of needle-shaped structures, hexagonal-plate structures, or a mixture thereof are oriented. 
     
     
         18 . The assembly of  claim 12 , wherein the plurality of needle-shaped structures, hexagonal-plate structures, or a mixture thereof comprise an average crystallite size in a range of from about 10 nm to about 50 nm. 
     
     
         19 . The assembly of  claim 18 , wherein the plurality of needle-shaped structures, hexagonal-plate structures, or a mixture thereof comprise an average crystallite size in a range of from about 19 nm to about 33 nm. 
     
     
         20 . The assembly of  claim 12 , formed by the method of  claim 1 .