System and method of additively manufacturing an object

Abstract

A system for use in additively manufacturing an object. The system includes a powder bed configured for containment within a build chamber, wherein the powder bed is formed from a mixture of a build material and a bonding agent. The system also includes a heat source configured to selectively heat the powder bed to a temperature such that the build material is at least partially sintered together by the bonding agent. The heat source also selectively heats the powder bed to the temperature that maintains the build material in a solid state.

1 - 20 . (canceled) 
     
     
         21 . A system for use in additively manufacturing an object, the system comprising:
 a powder bed configured for containment within a build chamber, wherein the powder bed comprises a mixture of a build material and a bonding agent; and   a heat source configured to selectively heat the powder bed to a temperature such that the build material is at least partially sintered together by the bonding agent, wherein the heat source selectively heats the powder bed to the temperature that maintains the build material in a solid state.   
     
     
         22 . The system in accordance with  claim 21 , wherein the heat source comprises at least one of a projection raster heating device, an electron beam projector, a spark heating device, or a multiplexed laser array. 
     
     
         23 . The system in accordance with  claim 21 , wherein the heat source has a maximum power level configured to provide an amount of energy to the powder bed that is a predetermined percentage of a volumetric heating value required to melt the build material. 
     
     
         24 . The system in accordance with  claim 21 , wherein the heat source has a maximum power level configured to heat the powder bed to the temperature that is about 70 percent of a value of a melting point of the build material. 
     
     
         25 . The system in accordance with  claim 21 , wherein the heat source has a maximum power level configured to heat the powder bed to the temperature that is greater than a melting point of the bonding agent and that is lower than a melting point of the build material. 
     
     
         26 . The system in accordance with  claim 21 , wherein the powder bed includes less than about 30 percent of the bonding agent by volume of the mixture. 
     
     
         27 . The system in accordance with  claim 21 , wherein the bonding agent has an average particle size of less than 30 microns. 
     
     
         28 . The system in accordance with  claim 21 , wherein the bonding agent has an average particle size of less than 10 microns. 
     
     
         29 . The system in accordance with  claim 21 , wherein the bonding agent comprises at least one of: titanium hydride or iron chloride. 
     
     
         30 . The system in accordance with  claim 21 , wherein the build material comprises at least one of: boron or silicon. 
     
     
         31 . The system in accordance with  claim 21 , wherein, when heated, the bonding agent thermally decomposes into a bonding component and an antioxidation component, and wherein the antioxidation component removes surface oxides from the build material. 
     
     
         32 . A system for use in additively manufacturing an object, the system comprising:
 a build chamber including a moveable build platform and a powder bed comprising a mixture of a build material and a bonding agent; and   a heat source configured to selectively heat the powder bed to a temperature such that the build material is at least partially sintered together by the bonding agent, wherein the heat source selectively heats the powder bed to the temperature that maintains the build material in a solid state.   
     
     
         33 . The system in accordance with  claim 32 , wherein the heat source comprises at least one of a projection raster heating device, an electron beam projector, a spark heating device, or a multiplexed laser array. 
     
     
         34 . The system in accordance with  claim 32 , wherein the heat source has a maximum power level configured to provide an amount of energy to the powder bed that is a predetermined percentage of a volumetric heating value required to melt the build material. 
     
     
         35 . The system in accordance with  claim 32 , wherein the heat source has a maximum power level configured to heat the powder bed to the temperature that is about 70 percent of a value of a melting point of the build material. 
     
     
         36 . The system in accordance with  claim 32 , wherein the heat source has a maximum power level configured to heat the powder bed to the temperature that is greater than a melting point of the bonding agent and that is lower than a melting point of the build material. 
     
     
         37 . The system in accordance with  claim 32 , wherein the bonding agent has an average particle size of less than 30 microns. 
     
     
         38 . The system in accordance with  claim 32 , wherein the bonding agent comprises at least one of: titanium hydride or iron chloride. 
     
     
         39 . The system in accordance with  claim 32 , wherein the build material comprises at least one of: boron or silicon. 
     
     
         40 . The system in accordance with  claim 32 , wherein, when heated, the bonding agent thermally decomposes into a bonding component and an antioxidation component, and wherein the antioxidation component removes surface oxides from the build material.