Heat-dissipating substrate with coating structure

Abstract

A heat-dissipating substrate with a coating structure is provided. The heat-dissipating substrate includes at least two layers. A base layer is a heat dissipation layer, and one or more sputtered layers are formed on the heat dissipation layer. The sputtered layer has a corrosion resistant property, a soldering ability, or a sintering ability. A thickness of the sputtered layer is less than 5000 nm.

What is claimed is: 
     
         1 . A heat-dissipating substrate with a coating structure, comprising at least two layers; wherein a base layer is a heat dissipation layer, the heat dissipation layer has one or more projections, one or more sputtered layers are formed on the projection, the sputtered layer has at least one of a corrosion resistant property, a soldering ability, and a sintering ability, and a thickness of the sputtered layer is less than 5000 nm. 
     
     
         2 . The heat-dissipating substrate according to  claim 1 , wherein the heat dissipation layer is made of a copper alloy or an aluminum alloy. 
     
     
         3 . The heat-dissipating substrate according to  claim 2 , wherein the sputtered layer is at least one of a sputtered nickel layer, a sputtered copper layer, a sputtered silver layer, a sputtered nickel alloy layer, a sputtered copper alloy layer, and a sputtered silver alloy layer. 
     
     
         4 . The heat-dissipating substrate according to  claim 3 , wherein a thickness precision of the sputtered layer is ±0.2 μm. 
     
     
         5 . A heat-dissipating substrate with a coating structure, comprising at least two layers; wherein a base layer is a heat dissipation layer, the heat dissipation layer has one or more concavities, one or more sputtered layers are formed on the concavity, the sputtered layer has at least one of a corrosion resistant property, a soldering ability, and a sintering ability, and a thickness of the sputtered layer is less than 5000 nm. 
     
     
         6 . The heat-dissipating substrate according to  claim 5 , wherein the heat dissipation layer is made of a copper alloy or an aluminum alloy. 
     
     
         7 . The heat-dissipating substrate according to  claim 6 , wherein the sputtered layer is at least one of a sputtered nickel layer, a sputtered copper layer, a sputtered silver layer, a sputtered nickel alloy layer, a sputtered copper alloy layer, and a sputtered silver alloy layer. 
     
     
         8 . The heat-dissipating substrate according to  claim 7 , wherein a thickness precision of the sputtered layer is ±0.2 μm. 
     
     
         9 . A heat-dissipating substrate with a coating structure, comprising at least two layers; wherein a base layer is a heat dissipation layer, the heat dissipation layer has one or more platforms, one or more sputtered layers are formed on the platform, the sputtered layer has at least one of a corrosion resistant property, a soldering ability, and a sintering ability, and a thickness of the sputtered layer is less than 5000 nm. 
     
     
         10 . The heat-dissipating substrate according to  claim 9 , wherein the heat dissipation layer is made of a copper alloy or an aluminum alloy. 
     
     
         11 . The heat-dissipating substrate according to  claim 10 , wherein the sputtered layer is at least one of a sputtered nickel layer, a sputtered copper layer, a sputtered silver layer, a sputtered nickel alloy layer, a sputtered copper alloy layer, and a sputtered silver alloy layer. 
     
     
         12 . The heat-dissipating substrate according to  claim 11 , wherein a thickness precision of the sputtered layer is ±0.2 μm.