Camera Module with Compression-Molded Circuit Board and Manufacturing Method Thereof

Abstract

A camera module with compression-molded circuit board is manufactured by compression-molding that can obtain properties such as high flatness, ultra-thin, fine wiring width and high integration.

What is claimed is: 
     
         1 . A compression-molded circuit board of camera module, wherein the camera module comprises a photosensitive chip, wherein said compression-molded circuit board comprises a circuit and at least one circuit board body, wherein said circuit board body and said circuit are molded into an integral structure by compression-molding for electrically connecting with the photosensitive chip of the camera module, wherein said compression-molded circuit board comprises a plurality of conductive members and a resin material, wherein said conductive members are added together with said resin material and are being heated in a compression-molding process to form said at least one circuit board body, wherein said conductive members forms at least a part of said circuit. 
     
     
         2 . The compression-molded circuit board, as recited in  claim 1 , wherein said at least one circuit board body comprises a reinforcing plate, wherein said resin material comprises one or more laminated epoxy resin members being integrally compression-molded on said reinforcing plate by compression-molding, wherein said conductive members are embedded in said one or more laminated epoxy resin members to form a multi-layer structure. 
     
     
         3 . The compression-molded circuit board, as recited in  claim 1 , wherein a layer of said conductive members and a layer of said resin material are repeatedly and overlappedly added in the compression-molding process to form said multi-layer structure 
     
     
         4 . The compression-molded circuit board, as recited in  claim 2 , wherein said circuit further comprises one or more electrical components mounted on said at least one circuit board body and connected with said conductive members. 
     
     
         5 . The compression-molded circuit board, as recited in  claim 1 , wherein said circuit has a wiring width of 0.01 mm to 0.09 mm, wherein a thickness of said at least one circuit board body is 0.1 mm to 0.6 mm. 
     
     
         6 . The compression-molded circuit board, as recited in  claim 1 , wherein the camera module further comprises an optical lens, wherein said compression-molded circuit board further comprises a recessed bracket integrally molded on said at least one circuit board body for mounting the optical lens. 
     
     
         7 . The compression-molded circuit board, as recited in  claim 1 , wherein said resin material is a hot melting material. 
     
     
         8 . The compression-molded circuit board, as recited in  claim 1 , wherein said resin material is a hot setting material. 
     
     
         9 . A camera module, comprising:
 an optical lens;   a photosensitive chip; and   a compression-molded circuit board, wherein said optical lens is supported above said compression-molded circuit board and is located in an optical path of said photosensitive chip, wherein said compression-molded circuit board comprises a circuit and at least one circuit board body, wherein said circuit board body and said circuit are molded into an integral structure by compression-molding and are electrically connecting with said photosensitive chip, wherein said compression-molded circuit board comprises a plurality of conductive members and a resin material, wherein said conductive members are added together with said resin material and are being heated in a compression-molding process to form said at least one circuit board body, wherein said conductive members forms at least a part of said circuit.   
     
     
         10 . The camera module, as recited in  claim 9 , wherein said at least one circuit board body comprises a reinforcing plate, wherein said resin material comprises one or more laminated epoxy resin members being integrally compression-molded on said reinforcing plate by compression-molding, wherein said conductive members are embedded in said one or more laminated epoxy resin members to form a multi-layer structure. 
     
     
         11 . The camera module, as recited in  claim 10 , wherein a layer of said conductive members and a layer of said resin material are repeatedly and overlappedly added in the compression-molding process to form said multi-layer structure 
     
     
         12 . The camera module, as recited in  claim 10 , wherein said circuit further comprises one or more electrical components mounted on said at least one circuit board body and connected with said conductive members. 
     
     
         13 . The camera module, as recited in  claim 10 , wherein said circuit has a wiring width of 0.01 mm to 0.09 mm, wherein a thickness of said at least one circuit board body is 0.1 mm to 0.6 mm. 
     
     
         14 . The camera module, as recited in  claim 10 , wherein said compression-molded circuit board further comprises a recessed bracket integrally molded on said at least one circuit board body for mounting said optical lens. 
     
     
         15 . The camera module, as recited in  claim 14 , further comprising a motor mounted on said recessed bracket, wherein said optical lens is mounted on said motor such that said compression-molded circuit board and said motor are provided on two opposite sides of said bracket respectively and said optical lens is able to be driven by said motor for auto-focusing. 
     
     
         16 . The camera module, as recited in  claim 10 , wherein said camera module is a fixed-focal camera module. 
     
     
         17 . The camera module, as recited in  claim 10 , wherein said conductive members and said one or more laminated epoxy resin members are molded on said reinforcing plate in such a manner one inner layer of said one or more laminated epoxy resin members is laminated on said reinforcing plate, at least one layer of said one or more conductive members is laminated on said inner layer of said one or more laminated epoxy resin members, and then one outer layer of said one or more laminated epoxy resin members is laminated on said at least one layer of said one or more conductive members while another one or more of said one or more conductive members are transversely extending from said reinforcing plate to outside of said outer layer of said one or more laminated epoxy resin members to selectively connect with said one or more electrical components and said at least one layer of said one or more conductive members to form said circuit. 
     
     
         18 . The camera module, as recited in  claim 14 , wherein said conductive members and said one or more laminated epoxy resin members are molded on said reinforcing plate in such a manner one inner layer of said one or more laminated epoxy resin members is laminated on said reinforcing plate, at least one layer of said one or more conductive members is laminated on said inner layer of said one or more laminated epoxy resin members, and then one outer layer of said one or more laminated epoxy resin members is laminated on said at least one layer of said one or more conductive members while another one or more of said one or more conductive members are transversely extending from said reinforcing plate to outside of said outer layer of said one or more laminated epoxy resin members to selectively connect with said one or more electrical components and said at least one layer of said one or more conductive members to form said circuit 
     
     
         19 . The camera module, as recited in  claim 10 , wherein said resin material is a hot melting material. 
     
     
         20 . The camera module, as recited in  claim 10 , wherein said resin material is a hot setting material.