Temperature tunable multi-zone electrostatic chuck

Abstract

Implementations described herein provide a method for calibrating a temperature of a substrate support assembly which enables discrete tuning of the temperature profile of a substrate support assembly. In one embodiment, a system, comprises a memory, wherein the memory includes an application program configured to perform an operation on a substrate support assembly, a control board disposed in a substrate support assembly, wherein the control board comprises a processor having an wireless interface, a pulse width modification (PWM) heater controller, wherein the processor is connected with the memory to read and access the application program from the memory when in operation, and a heating element coupled to the pulse width modification (PWM) heater controller, wherein the heating element comprises a plurality of spatially tunable heaters that are individually tunable by the pulse width modification (PWM) heater controller.

We claim: 
     
         1 . A system, comprising:
 a substrate support assembly;   a memory, wherein the memory includes an application program; and   a control board disposed in the substrate support assembly, wherein the control board comprises:
 a processor having an wireless interface; 
 a pulse width modification (PWM) heater controller, wherein the processor is connected with the memory to read and access the application program from the memory when in operation; and 
 a heating element coupled to the pulse width modification (PWM) heater controller, wherein the heating element comprises a plurality of spatially tunable heaters that are individually tunable by the pulse width modification (PWM) heater controller. 
   
     
     
         2 . The system of  claim 1 , wherein the memory is located in the control board. 
     
     
         3 . The system of  claim 1 , wherein the memory is located remote from the control board in the substrate support assembly. 
     
     
         4 . The system of  claim 1 , further comprising:
 an external controller electrically coupled to the control board.   
     
     
         5 . The system of  claim 4 , wherein the external controller further comprises:
 a first power supply electrically coupled to the processor.   
     
     
         6 . The system of  claim 5 , wherein the first power supply is configured to provide power to the heating element. 
     
     
         7 . The system of  claim 5 , wherein the external controller does not comprise a programing processor. 
     
     
         8 . The system of  claim 5 , wherein the external controller further comprises a second power supply. 
     
     
         9 . The system of  claim 5 , wherein the external controller comprises a single current clamp. 
     
     
         10 . The system of  claim 1 , wherein the processor is wirelessly controllable. 
     
     
         11 . The system of  claim 1 , wherein the processor is operable to automatically execute instructions stored in the memory upon application of power above a predefined threshold. 
     
     
         12 . A method of performing a process on a substrate support assembly, the method comprising:
 measuring a first temperature profile of a substrate support assembly when performing a process on a substrate disposed on the substrate support assembly;   determining a temperature offset map by comparing the first temperature profile with a target temperature profile by a processor disposed in the substrate support assembly;   determining tuning parameters by the processor to calibrate the first temperature profile to the target temperature profile for the substrate support assembly; and   storing the tuning parameters in a memory disposed in the substrate support assembly.   
     
     
         13 . The method of  claim 12 , wherein the processor is wirelessly controllable to perform the tuning parameters. 
     
     
         14 . The method of  claim 12 , wherein the first temperature profile may be measured by a temperature sensors and transmitted to a controller for further processing and/or analysis. 
     
     
         15 . The method of  claim 12 , wherein the tuning offset map may determine how much temperature increase or decrease is needed for each cell of a support surface of the substrate support assembly. 
     
     
         16 . The method of  claim 12  further comprising:
 supplying power to individual spatially tunable heaters to provide different level/amount of the voltage level thereto, wherein the different voltage influences thermal energy generated by each individual spatially tunable heaters to locally control the temperature setting of the support surface.