Substrate treating apparatus

Abstract

A substrate treating apparatus includes a plurality of solution treating units for performing solution treatment of substrates, and a plurality of individual gas supply devices provided to correspond individually to the solution treating units, each for supplying gas at a variable rate only to one of the solution treating units. The solution treating units perform the solution treatment by supplying treating solutions to the substrates. The individual gas supply devices supply gas only to the solution treating units corresponding thereto. The individual gas supply devices supply the gas at adjustable rates to the solution treating units. The rate of gas supply to the solution treating units can therefore be varied for each solution treating unit.

What is claimed is: 
     
         1 . A substrate treating apparatus comprising:
 a treating block having:
 a transporting space including a first divided transporting space and a second divided transporting space, 
 a first main transport mechanism installed in the first divided transporting space, and 
 a second main transport mechanism installed in the second divided transporting space; and 
   a transporting space gas supply device configured to supply gas to the transporting space;   the first divided transporting space corresponding to an upper part of the transporting space;   the second divided transporting space corresponding to a lower part of the transporting space;   wherein the transporting space gas supply device includes:
 a supply fan installed outside the transporting space; and 
 a chemical adsorption filter installed on a primary side or a secondary side of the supply fan. 
   
     
     
         2 . The substrate treating apparatus according to  claim 1 , wherein:
 the primary side is open to the exterior of the substrate treating apparatus; and   the supply fan is configured to take in ambient gas from outside the substrate treating apparatus, and send the gas into the transporting space.   
     
     
         3 . The substrate treating apparatus according to  claim 1 , wherein:
 the primary side is open upward of the substrate treating apparatus; and   the supply fan is configured to take in ambient gas from above the substrate treating apparatus, and send the gas into the transporting space.   
     
     
         4 . The substrate treating apparatus according to  claim 1 , wherein the transporting space gas supply device comprises:
 a first blowout unit connected in communication with the supply fan and configured to blow out gas to the first divided transporting space; and   a second blowout unit connected in communication with the supply fan and configured to blow out gas to the second divided transporting space.   
     
     
         5 . The substrate treating apparatus according to  claim 4 , wherein:
 the first blowout unit is installed in an upper part of the first divided transporting space; and   the second blowout unit is installed in an upper part of the second divided transporting space.   
     
     
         6 . The substrate treating apparatus according to  claim 1 , wherein the first transporting space and the second transporting space are separated from each other. 
     
     
         7 . The substrate treating apparatus according to  claim 1 , wherein the transporting space gas supply device is configured to supply gas only to the transporting space. 
     
     
         8 . The substrate treating apparatus according to  claim 7 , wherein the treating block comprises:
 a solution treating unit; and   a heat treating unit; and   wherein the transporting space gas supply device is configured not to supply gas to either the solution treating unit or the heat treating unit.