Mitigation of contamination of electroplated cobalt-platinum films on substrates

Abstract

Various embodiments to mitigate the contamination of electroplated cobalt-platinum films on substrates are described. In one embodiment, a method of manufacture of a device includes depositing a diffusion barrier over a substrate, depositing a seed layer upon the diffusion barrier, and depositing a cobalt-platinum magnetic layer upon the seed layer. In a second embodiment, a method of manufacture of a device may include depositing a diffusion barrier over a substrate and depositing a cobalt-platinum magnetic layer upon the diffusion barrier. In a third embodiment, a method of manufacture of a device may include depositing an adhesion layer over a substrate, depositing a seed layer upon the adhesion layer, and depositing a cobalt-platinum magnetic layer over the seed layer. Based in part on these methods of manufacture, improvements in the interfaces between the layers can be achieved after annealing with substantial improvements in the magnetic properties of the cobalt-platinum magnetic layer.

1 . A method of manufacture of a device including a magnetic layer, comprising:
 depositing a diffusion barrier over a substrate;   depositing a seed layer upon the diffusion barrier, wherein the seed layer comprises at least one of platinum, cobalt, palladium, ruthenium, rhodium, osmium, or iridium; and   depositing a cobalt-platinum magnetic layer upon the seed layer.   
     
     
         2 . The method of manufacture according to  claim 1 , wherein the substrate comprises at least one of 100, 110, or 111-oriented single crystal silicon. 
     
     
         3 . The method of manufacture according to  claim 1 , wherein the substrate comprises at least one of single crystal silicon, silicon compound, polycrystalline silicon, silicon dioxide, silicon carbide, or silicon nitride. 
     
     
         4 . The method of manufacture according to  claim 1 , wherein the substrate comprises at least one of germanium, gallium arsenide, quartz, or ceramic compound. 
     
     
         5 . The method of manufacture according to  claim 1 , wherein depositing the diffusion barrier comprises depositing the diffusion barrier through a physical vapor deposition process. 
     
     
         6 . The method according to  claim 5 , wherein the diffusion barrier comprises at least one of titanium nitride, tantalum nitride, tungsten nitride, indium oxide, nickel, tantalum, halfnium, niobium, zirconium, vanadium, or tungsten. 
     
     
         7 . The method according to  claim 6 , wherein the cobalt-platinum magnetic layer comprises a face-centered tetragonal structure. 
     
     
         8 . A method of manufacture of a device including a magnetic layer, comprising:
 depositing a diffusion barrier over a substrate; and   depositing a cobalt-platinum magnetic layer upon the diffusion barrier.   
     
     
         9 . The method according to  claim 8 , wherein the diffusion barrier comprises at least one of titanium nitride, tantalum nitride, tungsten nitride, indium oxide, nickel, tantalum, halfnium, niobium, zirconium, vanadium, or tungsten. 
     
     
         10 . The method according to  claim 8 , wherein depositing the cobalt-platinum magnetic layer comprises electroplating the cobalt-platinum magnetic layer upon the diffusion barrier at a thickness of less than about three microns. 
     
     
         11 . The method according to  claim 10 , further comprising annealing the cobalt-platinum magnetic layer to induce a crystallographic ordering of the cobalt-platinum magnetic layer from a disordered phase to an ordered equilibrium phase. 
     
     
         12 . The method of manufacture according to  claim 8 , wherein depositing the diffusion barrier comprises depositing the diffusion barrier through a physical vapor deposition process. 
     
     
         13 . A method of manufacture of a device including a magnetic layer, comprising:
 depositing an adhesion layer over a substrate, wherein the adhesion layer comprises titanium;   depositing a seed layer upon the adhesion layer, wherein the seed layer comprises at least one of platinum, cobalt, palladium, ruthenium, rhodium, osmium, or iridium; and   depositing a cobalt-platinum magnetic layer over the seed layer.   
     
     
         14 . The method according to  claim 13 , wherein depositing the cobalt-platinum magnetic layer comprises electroplating the cobalt-platinum magnetic layer upon the seed layer at a thickness of less than about three microns. 
     
     
         15 . The method according to  claim 14 , further comprising annealing the cobalt-platinum magnetic layer to induce a crystallographic ordering of the cobalt-platinum magnetic layer from a disordered phase to an ordered equilibrium phase. 
     
     
         16 . The method according to  claim 16 , wherein the adhesion layer is deposited over the substrate through a physical vapor deposition process in an atmosphere of nitrogen. 
     
     
         17 . The method according to  claim 16 , further comprising, before depositing the adhesion layer, depositing a diffusion barrier over the substrate.