US2022261610A1PendingUtilityA1

Modular ngsff module to meet different density and length requirements

Assignee: SAMSUNG ELECTRONICS CO LTDPriority: Sep 22, 2017Filed: Feb 28, 2022Published: Aug 18, 2022
Est. expirySep 22, 2037(~11.1 yrs left)· nominal 20-yr term from priority
Inventors:Zhan Ping
G06F 13/387H05K 1/18G06F 1/187G06K 19/07732G06F 13/4081
64
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Claims

Abstract

An assembly for a solid-state drive (SSD) includes a base printed circuit board having a PCIe adapter form factor, and at least one U.2 connector that is capable of being connected to a NGSFF device. The NGSFF device includes an NGSFF PCB, a first PCIe connector and a second PCIe connector. The NGSFF PCB is capable of receiving at least one SSD device and includes a first end and a second end in which the first end is opposite the second end. The first PCIe connector is at an edge of the first end of the NGSFF PCB and is capable of physical insertion into the at least one U.2 connector on the base PCB, and the second PCIe connector is at an edge of the second end of the NGSFF PCB and is capable of receiving a first PCIe connector of another NGSFF PCB.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . An assembly for a solid-state drive (SSD), comprising:
 a base printed circuit board (PCB) having a peripheral component interconnect express (PCIe) adapter form factor; and   at least one U.2 connector capable of being connected to a next generation small form factor (NGSFF) device.

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