US2022251722A1PendingUtilityA1
Anodization apparatus and anodization method
Est. expiryFeb 10, 2041(~14.5 yrs left)· nominal 20-yr term from priority
Inventors:Mie Matsuo
C25D 21/14C25D 21/06C25D 17/06C25D 17/02C25D 17/002C25D 11/005C25D 11/32C25D 11/02
57
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
According to one embodiment, an anodization apparatus includes: a first process tank configured to perform an anodization process on a substrate; a holder configured to hold the substrate; and a first electrolyte supply system configured to supply a first electrolyte to the first process tank. The holder immerses the substrate in the first electrolyte in a state where the substrate is inclined with respect to a liquid level of the first electrolyte. The anodization process is executed in a state where the substrate is inclined with respect to the liquid level of the first electrolyte.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . An anodization apparatus comprising:
a first process tank configured to perform an anodization process on a substrate; a holder configured to hold the substrate; and a first electrolyte supply system configured to supply a first electrolyte to the first process tank, wherein the holder immerses the substrate in the first electrolyte in a state where the substrate is inclined with respect to a liquid level of the first electrolyte, and the anodization process is executed in a state where the substrate is inclined with respect to the liquid level of the first electrolyte.
2 . The anodization apparatus according to claim 1 , wherein
the holder is rotated when the anodization process is performed.
3 . The anodization apparatus according to claim 1 , further comprising:
an anode provided in the holder; a second process tank provided in the first process tank; a cathode provided in the second process tank; and a diffusion plate provided at one end of the second process tank.
4 . The anodization apparatus according to claim 3 , wherein
the diffusion plate is provided at the one end of the second process tank in a state where it is inclined with respect to a bottom surface of the first process tank.
5 . The anodization apparatus according to claim 3 , wherein
when the anodization process is performed, the substrate and the diffusion plate are provided in a state of being inclined with respect to a bottom surface of the first process tank.
6 . The anodization apparatus according to claim 3 , wherein
when the anodization process is performed, the substrate and the diffusion plate are provided in parallel.
7 . The anodization apparatus according to claim 3 , wherein
the first electrolyte is supplied from the first electrolyte supply system to the second process tank, and the first electrolyte in the second process tank is supplied to a front surface of the substrate via the diffusion plate.
8 . The anodization apparatus according to claim 3 , further comprising:
a filter provided between the cathode and the diffusion plate.
9 . The anodization apparatus according to claim 3 , further comprising:
a second electrolyte supply system configured to supply a second electrolyte between the anode and the substrate.
10 . The anodization apparatus according to claim 3 , wherein
when the anodization process is performed, the substrate and the anode are provided in parallel.
11 . The anodization apparatus according to claim 1 , wherein
the first electrolyte supply system includes: a mixing tank used for producing the first electrolyte; an ingredient supply unit that supplies ingredients of the first electrolyte to the mixing tank; and a pump that supplies the first electrolyte produced at the mixing tank to the first process tank.
12 . The anodization apparatus according to claim 11 , wherein
the first electrolyte supply system is configured to recover the first electrolyte from the first process tank, and the recovered first electrolyte is supplied to the mixing tank.
13 . An anodization method comprising:
supplying a first electrolyte to a process tank; setting a substrate on a holder in a manner facing an anode provided in the holder; filling a second electrolyte between the anode and the substrate; immersing the substrate set on the holder in the first electrolyte in a state where the substrate is inclined with respect to a liquid level of the first electrolyte; and in a state where the substrate is inclined, applying a current between the anode and a cathode provided in the process tank.
14 . The anodization method according to claim 13 , further comprising rotating the substrate and the holder in a state where the substrate is inclined.Join the waitlist — get patent alerts
Track US2022251722A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.