US2022250909A1PendingUtilityA1
Hexagonal boron nitride structures
Est. expiryDec 28, 2037(~11.4 yrs left)· nominal 20-yr term from priority
C23C 18/36C23C 18/285C23C 18/38C23C 18/2086C23C 18/1657C23C 18/42C01P 2004/30C23C 16/342C23C 18/1689C23C 18/32C01B 21/0648C23C 18/30G03F 1/20C23C 18/1641G03F 1/60C01P 2004/22
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Claims
Abstract
A microstructure comprises a plurality of interconnected units wherein the units are formed of hexagonal boron nitride (h-BN) tubes. The graphene tubes may be formed by photo-initiating the polymerization of a monomer in a pattern of interconnected units to form a polymer microlattice, removing unpolymerized monomer, coating the polymer microlattice with a metal, removing the polymer microlattice to leave a metal microlattice, depositing an h-BN precursor on the metal microlattice, converting the h-BN precursor to h-BN, and removing the metal microlattice.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A process for preparing a 2D h-BN microstructure comprising the steps of:
photo-initiating the polymerization of a monomer in a pattern of interconnected units to form a polymer microlattice; removing unpolymerized monomer; coating the polymer microlattice with a metal; removing the polymer microlattice to leave a metal microlattice; depositing a 2D h-BN precursor on the metal microlattice; converting the 2D h-BN precursor to 2D h-BN; and removing the metal microlattice.
2 . The process of claim 1 , wherein photo-initiating the polymerization of the monomer includes passing collimated light through a photomask.
3 . The process of claim 1 , wherein photo-initiating the polymerization of the monomer includes multi-photon lithography.
4 . The process of claim 1 , wherein coating the polymer microlattice with a metal includes the electroless deposition of nickel.
5 . The process of claim 1 , wherein the polymer microlattice includes polystyrene.
6 . The process of claim 1 , wherein the polymer microlattice includes poly(methyl methacrylate).
7 . The process of claim 4 , further comprising:
removing unwanted particles by cleaning the microlattice with a series of chemicals prior to electroless plating.
8 . The process of claim 7 , wherein the microlattice is rinsed with water following the cleaning with each respective chemical of the series of chemicals.
9 . A 2D h-BN microstructure prepared by the process comprising the steps of:
photo-initiating the polymerization of a monomer in a pattern of interconnected units to form a polymer microlattice; removing unpolymerized monomer; coating the polymer microlattice with a metal; removing the polymer microlattice to leave a metal microlattice; depositing a 2D h-BN precursor on the metal microlattice; converting the 2D h-BN precursor to 2D h-BN; and removing the metal microlattice.
10 . The 2D h-BN microstructure of claim 9 , wherein photo-initiating the polymerization of the monomer includes passing collimated light through a photomask.
11 . The 2D h-BN microstructure of claim 9 , wherein photo-initiating the polymerization of the monomer includes multi-photon lithography.
12 . The 2D h-BN microstructure of claim 9 , wherein coating the polymer microlattice with a metal includes the electroless deposition of nickel.
13 . The 2D h-BN microstructure of claim 9 , wherein the polymer microlattice includes polystyrene.
14 . The 2D h-BN microstructure of claim 9 , wherein the polymer microlattice comprises poly(methyl methacrylate).
15 . The 2D h-BN microstructure of claim 12 , wherein the process further includes removing unwanted particles by cleaning the microlattice with a series of chemicals prior to electroless plating.
16 . The 2D h-BN microstructure of claim 15 , wherein the process further includes rinsing the microlattice with water following cleaning with each respective chemical of the series of chemicals.Join the waitlist — get patent alerts
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