Random Walk Polishing Machine

Abstract

A polishing machine for fine polishing and abrading work configured to employ a random walk theory algorithm to generate the movement pattern of the polishing or abrading element.

1 . A machine for polishing a workpiece comprising: a supporting surface for securing and supporting the workpiece; a polishing surface for polishing the workpiece secured to the top of the supporting surface; a mounting arrangement for supporting said supporting surface and said polishing surface with said mounting arrangement configured in a generally cylindrical shape and comprising a base, a casing and an upper plate; a movement arrangement for moving said polishing surface with respect to said supporting surface and across said workpiece with said movement arrangement housed within the said casing of said mounting arrangement and comprising a first oscillatory motor secured to said casing; a first eccentric ball bearing disposed on top of the first oscillatory motor and further disposed below and in contact with a second oscillatory motor disposed above the first oscillatory motor; a second eccentric ball bearing disposed on top of the second oscillatory motor; with said mounting arrangement further configured such that the second eccentric ball bearing is in contact with the bottom of the supporting surface; a first power source to operate the first oscillatory motor and a second power source to the second oscillatory motor, whereby said polishing surface moves across said workpiece in a number of random polishing paths generated by the combined operation of the first oscillatory motor operating at a first frequency and the second oscillatory motor operating at a second frequency. 
     
     
         2 . The machine for polishing a workpiece of  claim 1  wherein the first frequency of the first oscillatory motor and the second frequency of the second oscillatory motor are uncorrelated both between and among them. 
     
     
         3 . The machine for polishing a workpiece of  claim 1  wherein the first oscillatory motor is coupled to the second oscillatory motor by means of at least one flange configured to secure the base of the second oscillatory motor and further configured to secure the first eccentric ball bearing to the second oscillatory motor. 
     
     
         4 . The machine for polishing a workpiece of  claim 1  wherein the movement arrangement is secured within the case of the mounting arrangement by means of a blocking ring. 
     
     
         5 . The machine for polishing a workpiece of  claim 1  wherein the supporting surface is comprised of hard rubber. 
     
     
         6 . The machine for polishing a workpiece of  claim 1  wherein the polishing surface comprises removable sanding pads. 
     
     
         7 . The machine for polishing a workpiece of  claim 1  wherein the supporting surface comprises embedded supports for supporting the workpiece. 
     
     
         8 . The machine for polishing a workpiece of  claim 1  wherein said polishing surface has either a plane or curved shape and said polishing surface executes random-walk movements across said workpiece wherein said random-walk movements do not replicate a planetary movement, figure-eight pattern or any other Lissajous figures.