Method of forming stretchable encapsulation for electronic displays

Abstract

A method of encapsulating an organic light-emitting diode display includes depositing a plurality of first polymer projections onto a light-emitting side of a display layer having a plurality of organic light-emitting diodes (OLEDs) such that the plurality of first polymer projections have spaces therebetween that expose an underlying surface, and conformally coating the first polymer projections and the spaces between the first polymer projections with a first dielectric layer such that the first dielectric layer has side walls along sides of the first polymer projections and defines wells in spaces between the side walls.

1 - 20 . (canceled) 
     
     
         21 . A method of encapsulating an organic light-emitting diode display, the method comprising:
 ejecting droplets of a first liquid polymer precursor onto a light-emitting side of a display layer having an array of light-emitting diodes;   curing the first liquid polymer precursor to form a plurality of first polymer projections that have spaces therebetween that expose an underlying surface with both the plurality of first polymer projections and spaces therebetween positioned over the array of light-emitting diodes; and   conformally coating the first polymer projections and the spaces between the first polymer projections with a first dielectric layer such that the first dielectric layer has side walls along sides of the first polymer projections and defines wells in spaces between the side walls.   
     
     
         22 . The method of  claim 21 , further comprising depositing a first polymer filler to at least partially fill the wells between the side walls. 
     
     
         23 . The method of  claim 22 , wherein the first polymer filler fills the wells and covers the first dielectric layer in regions over the first polymer projections. 
     
     
         24 . The method of  claim 21 , comprising depositing an underlying dielectric layer to contact and conformally covering the display layer, and depositing the first polymer projections on the underlying dielectric layer. 
     
     
         25 . The method of  claim 24 , wherein the underlying dielectric layer is the same material as the first dielectric layer. 
     
     
         26 . The method of  claim 21 , comprising ejecting droplets of liquid polymer precursor directly on the display layer. 
     
     
         27 . The method of  claim 26 , comprising ejecting droplets of liquid polymer precursor directly on a capping layer of the display layer. 
     
     
         28 . The method of  claim 21 , wherein ejecting droplets of liquid polymer precursor comprises ejecting a sequence of droplets with each droplet forming a single projection from the plurality of first polymer projections. 
     
     
         29 . The method of  claim 28 , wherein the droplet forms a curved convex projection on the underlying surface. 
     
     
         30 . The method of  claim 21 , comprising:
 ejecting droplets of a second liquid polymer precursor onto the first dielectric layer;   curing the second liquid polymer precursor to form a plurality of second polymer projections that have spaces therebetween that expose an underlying surface with both the plurality of second polymer projections and spaces therebetween positioned over the array of light-emitting diodes; and   conformally coating the second polymer projections and the spaces between the second polymer projections with a second dielectric layer such that the second dielectric layer has side walls along sides of the second polymer projections and defines wells in spaces between the side walls.   
     
     
         31 . The method of  claim 30 , wherein the plurality of first polymer projections and the plurality of second polymer projections are the same polymer material, and the first dielectric layer and second dielectric layer are the same dielectric material. 
     
     
         32 . The method of  claim 30 , wherein the second dielectric layer contacts first dielectric layer. 
     
     
         33 . The method of  claim 21 , wherein the spaces between the side walls and the side walls are aligned with gaps between the light emitting diodes. 
     
     
         34 . A method of encapsulating an organic light-emitting diode display, the method comprising:
 performing imprint lithography to deposit a plurality of first polymer projections that have spaces therebetween that expose an underlying surface with both the plurality of first polymer projections and spaces therebetween positioned over the array of light-emitting diodes of a display layer; and   conformally coating the first polymer projections and the spaces between the first polymer projections with a first dielectric layer such that the first dielectric layer has side walls along sides of the first polymer projections and defines wells in spaces between the side walls.   
     
     
         35 . The method of  claim 34 , wherein the imprint lithography comprises micro-imprint or nano-imprint lithography. 
     
     
         36 . The method of  claim 34 , wherein the plurality of first polymer projections have a flat top surface.