Embedded copper structure for microelectronics package

Abstract

An electronic component and a method of manufacturing an electronic component, the method including surface mounting electronic components to a printed circuit board (PCB), applying a flip-chip die integrated circuit (IC) to the PCB and underfilling the flip-chip IC to secure the PCB. The method also includes sintering a copper block to the PCB, where the copper block is in thermal communication with the IC and acts as a thermal path for removing heat generated by the flip-chip IC.

1 . (canceled) 
     
     
         2 . An electronic component comprising:
 a printed circuit board (PCB) including an opening formed therein;   an integrated circuit (IC) placed in the opening and connected to the PCB;   underfill securing the IC to the PCB and   a copper block thermally connected to the (IC) and sintered to the PCB, wherein the copper block is in thermal communication with the IC and acts as a thermal path for removing heat generated by the IC.   
     
     
         3 . The electronic component of  claim 2 , wherein the IC is a flip-chip IC. 
     
     
         4 . The electronic component of  claim 3 , further comprising a thermal boding agent connecting the flip-chip IC to the copper block. 
     
     
         5 . The electronic component of  claim 2 , wherein the copper block further comprises a backside having a surface finish. 
     
     
         6 . The electronic component of  claim 2 , wherein the copper block is T-shaped. 
     
     
         7 . The electronic component of  claim 2 , wherein the copper block is flat. 
     
     
         8 . The electronic component of  claim 2 , further comprising a plurality of sinter columns, wherein the copper columns connect the copper block to the PCB. 
     
     
         9 . The electronic component of  claim 2 , wherein the opening is a hole through the PCB. 
     
     
         10 . The electronic component of  claim 2 , wherein the opening is a cavity in the PCB.