Method of manufacturing mounting substrate and method of manufacturing electronic apparatus

Abstract

A method of manufacturing a mounting substrate, the method includes: transferring part or all of a plurality of devices on a device substrate onto a wiring substrate, and temporarily fixing the transferred devices to the wiring substrate with use of a fixing layer having viscosity, the device substrate including a support substrate and the plurality of devices fixed on the support substrate; and performing a reflow process on the wiring substrate to electrically connect the transferred devices with the wiring substrate, and thereby forming the mounting substrate.

The invention is claimed as follows: 
     
         1 . A method of manufacturing a mounting substrate, the method comprising:
 transferring a plurality of elements to a wiring substrate, and temporarily fixing said plurality of elements to said wiring substrate by means of a viscous fixing layer; and   performing a reflow process on said wiring substrate to form the mounting substrate by electrically connecting said plurality of elements and said wiring substrate,   wherein each said plurality of elements have one or more first metal portions on its surface, and said wiring substrate has one or more second metal portions on its surface, and said one or more first metal portions and said one or more second metal portions has conductive protrusions that protrude beyond a surrounding area, and   wherein said one or more first metal portions and said one or more second metal portions are electrically connected to each other through said protrusions by said reflow process.   
     
     
         2 . The method according to  claim 1 , further comprising removing the fixing layer. 
     
     
         3 . The method according to  claim 1 , further comprising raising the degree of the viscosity of the fixing layer by one or more methods selected from the group consisting of heating, decompression, light irradiation, and addition of a curing agent. 
     
     
         4 . The method according to  claim 1 , wherein a viscosity modification process prevents the transferred plurality of devices from shifting during a period of time before the reflow process. 
     
     
         5 . A method of manufacturing an electronic apparatus, the method comprising:
 transferring a plurality of elements to a wiring substrate, and temporarily fixing said plurality of elements to said wiring substrate by means of a viscous fixing layer;   performing a reflow process on said wiring substrate to form the mounting substrate by electrically connecting said plurality of elements and said wiring substrate,   wherein each said plurality of elements have one or more first metal portions on its surface, and said wiring substrate has one or more second metal portions on its surface, and said one or more first metal portions and said one or more second metal portions has conductive protrusions that protrude beyond a surrounding area, and   wherein said one or more first metal portions and said one or more second metal portions are electrically connected to each other through said protrusions by said reflow process; and   forming the electronic apparatus including the mounting substrate.   
     
     
         6 . The method according to  claim 5 , further comprising removing the fixing layer. 
     
     
         7 . The method according to  claim 5 , further comprising raising the degree of the viscosity of the fixing layer by one or more methods selected from the group consisting of heating, decompression, light irradiation, and addition of a curing agent. 
     
     
         8 . The method according to  claim 5 , wherein a viscosity modification process prevents the transferred plurality of devices from shifting during a period of time before the reflow process.