US2022231062A1PendingUtilityA1

Imaging device, method of producing imaging device, imaging apparatus, and electronic apparatus

Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPPriority: Sep 12, 2017Filed: Apr 6, 2022Published: Jul 21, 2022
Est. expirySep 12, 2037(~11.1 yrs left)· nominal 20-yr term from priority
H04N 25/70H04N 23/55H04N 25/00H10F 39/805H10F 39/024H10F 77/40H10F 39/806H10F 39/804H10F 39/12H10F 39/811H01L 27/1462H01L 27/14618H01L 27/14685H04N 5/2254
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Claims

Abstract

Provided is an imaging device that enables formation of a film over the entirety of a film formation region, a method of producing the imaging device, an imaging apparatus, and an electronic apparatus. The imaging device includes a sensor and a glass sheet bonded to a front surface of the sensor. The glass sheet is provided with a recess in a peripheral portion thereof that is outside a film formation region thereof over which an inorganic film is to be formed. The recess corresponds to a claw provided on a periphery of an opening of a tray for a vapor deposition process for the inorganic film. This allows the entirety of the film formation region of the glass sheet to be exposed from the opening when the imaging device is set in the opening, and thus enables formation of the inorganic film over the entirety of the film formation region.

Claims

exact text as granted — not AI-modified
1 . An imaging device, comprising:
 a semiconductor substrate that includes a plurality of photodiodes;   a glass sheet on the semiconductor substrate, wherein
 the glass sheet includes:
 a film formation region; and 
 a peripheral portion outside the film formation region, and 
 
 the peripheral portion includes a recess; and 
   an inorganic film on the recess and the film formation region.   
     
     
         2 . The imaging device according to  claim 1 , wherein a shape of the recess corresponds to a claw on a periphery of an opening in a tray for formation of the inorganic film on the glass sheet. 
     
     
         3 . The imaging device according to  claim 1 , wherein the recess has a step-like shape. 
     
     
         4 . The imaging device according to  claim 1 , wherein the recess is tapered and has a flat surface. 
     
     
         5 . The imaging device according to  claim 1 , wherein the recess has a curved surface. 
     
     
         6 . The imaging device according to  claim 1 , wherein the inorganic film is on the glass sheet. 
     
     
         7 . The imaging device according to  claim 6 , wherein the inorganic film is one of an AR (Anti Reflection) film or an IRCF (Infra-Red Cut Filter) film. 
     
     
         8 . An imaging apparatus, comprising:
 a semiconductor substrate that includes a plurality of photodiodes;   a glass sheet on the semiconductor substrate, wherein
 the glass sheet includes:
 a film formation region; and 
 a peripheral portion outside the film formation region, and 
 
 the peripheral portion includes a recess; and 
   an inorganic film on the recess and the film formation region.   
     
     
         9 . An electronic apparatus, comprising:
 a semiconductor substrate that includes a plurality of photodiodes;   a glass sheet on the semiconductor substrate, wherein
 the glass sheet includes:
 a film formation region; and 
 a peripheral portion outside the film formation region, and 
 
 the peripheral portion includes a recess; and 
   an inorganic film on the recess and the film formation region.   
     
     
         10 . A method of producing an imaging device, the method comprising:
 attaching a semiconductor substrate with an undiced glass sheet to a dicing sheet;   forming first grooves in the undiced glass sheet along central lines of dicing lines using first blades having a specific width;   dicing the undiced glass sheet along the central lines of the dicing lines using second blades having a width smaller than the specific width, wherein
 the undiced glass sheet includes:
 a film formation region; and 
 a peripheral portion outside the film formation region, and 
 
 the peripheral portion includes a recess; and 
   forming an inorganic film on the recess and the film formation region.   
     
     
         11 . The method of producing the imaging device according to  claim 10 , wherein the first blades are V-shaped blades. 
     
     
         12 . The method of producing the imaging device according to  claim 10 , further comprising:
 forming second grooves in the undiced glass sheet along the central lines of the dicing lines using third blades, wherein   the second grooves has a larger depth than the first grooves, and   the third blades has a width smaller than the specific width of the first blades and larger than the width of the second blades; and   forming third grooves in the undiced glass sheet along the central lines of the dicing lines using fourth blades, wherein
 the third grooves has a smaller depth than the first grooves, and 
 the fourth blades has a width smaller than the width of the first blades and larger than the width of the third blades; and 
   dicing the undiced glass sheet along the central lines of the dicing lines using the second blades.   
     
     
         13 . The method of producing the imaging device according to  claim 12 , wherein
 the first blades and the fourth blades are same V-shaped blades, and   the first blades and the fourth blades are different in depth of grooves to form.   
     
     
         14 . The method of producing the imaging device according to  claim 10 , wherein the inorganic film is one of an AR (Anti Reflection) film or an IRCF (Infra-Red Cut Filter) film.

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