Chemical mechanical planarization tools, and related pads for chemical mechanical planarization tools

Abstract

A pad for chemical mechanical planarization comprises a material having a major surface, and asperities extending from the major surface, a ratio between a length and a width of each of the asperities greater than about 2:1, and an included angle between a leading surface of at least some asperities and the major surface greater than about 90°. Related pads, tools for chemical mechanical planarization, and related methods are also disclosed.

What is claimed is: 
     
         1 . A chemical mechanical planarization tool, comprising:
 a pad comprising a major surface;   a first group of asperities extending from the major surface of the pad, the asperities of the first group of asperities comprising:
 side surfaces extending from the major surface of the pad; and 
 an upper surface spanning between the side surfaces, at least a portion of the upper surface parallel to the major surface of the pad; and 
   a second group of asperities extending from the major surface of the pad, the asperities of the second group of asperities comprising:
 additional side surfaces extending from the major surface of the pad; and 
 an additional upper surface spanning between the additional side surfaces, the additional upper surface oriented at an angle with respect to the major surface of the pad. 
   
     
     
         2 . The chemical mechanical planarization tool of  claim 1 , wherein the upper surface of one or more of the asperities of the first group of asperities comprises an additional portion extending from the at least a portion of the upper surface to one of the side surfaces of the one or more asperities of the first group of asperities, the additional portion oriented at an additional angle with respect to the major surface of the pad. 
     
     
         3 . The chemical mechanical planarization tool of  claim 2 , wherein a distance between the major surface and the at least a portion of the upper surface parallel to the major surface of the pad is greater than another distance between the additional portion and the major surface of the pad. 
     
     
         4 . The chemical mechanical planarization tool of  claim 2 , wherein:
 the at least a portion of the upper surface parallel to the major surface is located proximate a leading surface of the one or more asperities of the first group of asperities; and   the additional portion is located proximate a trailing surface of the one or more asperities of the first group of asperities.   
     
     
         5 . The chemical mechanical planarization tool of  claim 1 , wherein:
 one or more asperities of the second group of asperities comprises a rotationally leading asperity; and   one or more asperities of the first group of asperities comprises a rotationally trailing asperity located rotationally behind the rotationally leading asperity.   
     
     
         6 . The chemical mechanical planarization tool of  claim 5 , wherein the additional upper surface of the rotationally leading asperity is farther from the major surface than the upper surface of the rotationally trailing asperity. 
     
     
         7 . The chemical mechanical planarization tool of  claim 1 , wherein:
 one or more asperities of the first group of asperities comprises a rotationally leading asperity; and   one or more asperities of the second group of asperities comprises a rotationally trailing asperity located rotationally behind the rotationally leading asperity.   
     
     
         8 . The chemical mechanical planarization tool of  claim 7 , wherein the upper surface of the rotationally leading asperity is closer to the major surface than the additional upper surface of the rotationally trailing asperity. 
     
     
         9 . The chemical mechanical planarization tool of  claim 1 , wherein asperities of the first group of asperities alternate with asperities of the second group of asperities in a radial direction. 
     
     
         10 . A chemical mechanical planarization tool, comprising:
 a circular pad; and   asperities extending from an upper surface of the circular pad, the asperities arranged on the upper surface to overlap one another in a radial direction and in a direction transverse to the radial direction.   
     
     
         11 . The chemical mechanical planarization tool of  claim 10 , wherein one or more asperities of the asperities comprises:
 an included angle between a leading surface of the one or more asperities and the upper surface of the circular pad greater than about 90°; and   a trailing surface included angle between a trailing surface of the one or more asperities and the upper surface greater than about 90° and different than the included angle.   
     
     
         12 . The chemical mechanical planarization tool of  claim 11 , wherein the trailing surface included angle is greater than the included angle. 
     
     
         13 . The chemical mechanical planarization tool of  claim 11 , wherein one or more additional asperities of the asperities comprises an additional included angle different than the included angle of the one or more asperities. 
     
     
         14 . The chemical mechanical planarization tool of  claim 13 , wherein the one or more additional asperities comprises a trailing surface included angle substantially the same as the trailing surface included angle of the one or more asperities. 
     
     
         15 . The chemical mechanical planarization tool of  claim 13 , wherein the one or more additional asperities comprises a trailing surface included angle different than the trailing surface included angle of the one or more asperities. 
     
     
         16 . The chemical mechanical planarization tool of  claim 10 , wherein a ratio of a pitch of the asperities in a direction transverse to the radial direction to a pitch of the asperities in the radial direction is within a range from about 1.0:1.0 to about 2.5:1.0. 
     
     
         17 . The chemical mechanical planarization tool of  claim 10 , wherein a transverse pitch of the asperities in a direction transverse to the radial direction is greater than a radial pitch of the asperities in the radial direction. 
     
     
         18 . The chemical mechanical planarization tool of  claim 10 , wherein the asperities each exhibit a length greater than a width thereof, a longitudinal axis of each asperity substantially parallel to a longitudinal axis of neighboring asperities and oriented at an angle with respect to a longitudinal axis of distal asperities. 
     
     
         19 . A pad for chemical mechanical planarization, the pad comprising:
 a material having a major surface; and   asperities on the major surface, the asperities comprising a leading surface, a trailing surface, an upper surface between the leading surface and the trailing surface, and a shearing edge at an intersection of the leading surface and the upper surface, one or more of an angle between the leading surface and the major surface, an angle between the trailing surface and the major surface, an angle between the upper surface and the major surface, and a skew angle of the asperities changing as a function of a distance from a center of the pad.   
     
     
         20 . The pad of  claim 19 , wherein the angle between the upper surface and the major surface changes as a function of the distance from the center of the pad.