US2022225545A1PendingUtilityA1
Intelligent dual purpose heat exchanger and fan wall for a datacenter cooling system
Est. expiryJan 14, 2041(~14.5 yrs left)· nominal 20-yr term from priority
Inventors:Ali Heydari
G06F 2200/201H05K 7/20254H05K 7/20263H05K 7/20836H05K 7/20281G06F 1/20H05K 7/20236H05K 7/20736H05K 7/20781H05K 7/20272
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Claims
Abstract
Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a liquid-to-air heat exchanger is associated with a fan wall of a rack and enables a datacenter cooling system to address a first cooling requirement of the rack in a first mode by air through the rack from the fan wall and to address a second cooling requirement of a fluid from at least one cold plate in the rack using the air through the liquid-to-air heat exchanger.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A datacenter cooling system, comprising:
a liquid-to-air heat exchanger associated with a fan wall of a rack, the datacenter cooling system to address a first cooling requirement of the rack in a first mode by air through the rack enabled by the fan wall with the liquid-to-air heat exchanger disabled, and to address a second cooling requirement of a fluid from at least one cold plate in the rack using the air to cause cooling associated with the liquid-to-air heat exchanger that is enabled to comprise the fluid circulating therein.
2 . The datacenter cooling system of claim 1 , further comprising:
at least one processor to determine a temperature associated with a computing device in the rack, and to cause the datacenter cooling system to operate in the first mode or the second mode.
3 . The datacenter cooling system of claim 1 , further comprising:
an immersive-cooled server within the rack, the immersive-cooled server to comprise a dielectric engineered fluid surrounding the computing device and to comprise a second heat exchanger to exchange heat between the dielectric engineered fluid and the fluid.
4 . The datacenter cooling system of claim 1 , further comprising:
the cold plate associated with the computing device and having first ports for a first portion of microchannels to support a secondary coolant distinctly from a second portion of the microchannels that support the fluid.
5 . The datacenter cooling system of claim 1 , further comprising:
at least one processor to receive sensor inputs from sensors associated with the computing device, the rack, a secondary coolant, or the fluid, the at least one processor to determine the first cooling requirement and the second cooling requirement based in part on the sensor inputs.
6 . The datacenter cooling system of claim 5 , further comprising:
one or more neural networks to receive the sensor inputs and to infer the first cooling requirement and the second cooling requirement.
7 . The datacenter cooling system of claim 1 , further comprising:
at least one processor to cause at least one flow controller to enable flow of the fluid through the liquid-to-air heat exchanger and to prevent flow of the fluid to a secondary cooling loop.
8 . The datacenter cooling system of claim 1 , further comprising:
at least one processor to cause one or more fans of the fan wall to be adjusted in the first mode differently than the second mode.
9 . The datacenter cooling system of claim 1 , further comprising:
a latching mechanism to enable the association of the liquid-to-air heat exchanger with the fan wall of the rack.
10 . The datacenter cooling system of claim 1 , further comprising:
at least one processor to receive sensor inputs from sensors associated with at least one computing device, the at least one processor to determine a change in a coolant state based in part on the sensor inputs and to cause the datacenter cooling system to operate in the first mode or the second mode.
11 . A processor comprising one or more circuits, the one or more circuits to determine cooling requirements for a datacenter cooling system, the processor to cause the datacenter cooling system to operate in a first mode to address a first cooling requirement by air through the rack enabled by a fan wall with an associated liquid-to-air heat exchanger disabled, and to cause the datacenter cooling system to operate in a second mode to address a second cooling requirement by the air through the liquid-to-air heat exchanger to cool fluid circulating therein from at least one cold plate in the rack.
12 . The processor of claim 11 , further comprising:
an output to provide signals for one or more flow controllers to enable flow of the fluid through the liquid-to-air heat exchanger and to prevent flow of the fluid to a secondary cooling loop in the second mode of the datacenter cooling system.
13 . The processor of claim 11 , further comprising:
an input to receive sensor inputs from sensors associated with at least one computing device, the rack, a secondary coolant, or the fluid, the processor to determine the first cooling requirement and the second cooling requirement based in part on the sensor inputs.
14 . The processor of claim 13 , further comprising:
one or more neural networks to receive the sensor inputs and to infer the first cooling requirement and the second cooling requirement.
15 . The processor of claim 11 , further comprising:
one or more neural networks to infer a failure of a secondary cooling loop or a primary cooling loop, the one or more circuits to cause one or more flow controllers to support the second mode.
16 . A processor comprising one or more circuits to cause a datacenter cooling system to operate in a first mode or a second mode, the datacenter cooling system comprising a fan wall and an associated liquid-to-air heat exchanger, the one or more circuits to train one or more neural networks to infer cooling requirements from sensor inputs of sensors associated with a rack or with a fluid from at least one cold plate, the first mode to address a first cooling requirement by air through the rack enabled by the fan wall with the liquid-to-air heat exchanger disabled and the second mode to address a second cooling requirement by the air through the liquid-to-air heat exchanger to cool the fluid circulating therein.
17 . The processor of claim 16 , further comprising:
an output to provide signals for one or more flow controllers to enable flow of the fluid through the liquid-to-air heat exchanger and to prevent flow of the fluid to a secondary cooling loop in the second mode of the datacenter cooling system.
18 . The processor of claim 16 , further comprising:
the one or more neural networks to receive the sensor inputs and to be trained to infer the first cooling requirement and the second cooling requirement as part of an analysis of prior sensor inputs and prior cooling requirements.
19 . The processor of claim 16 , further comprising:
an output to provide signals to cause one or more fans of the fan wall to be adjusted in the first mode differently than the second mode.
20 . The processor of claim 16 , further comprising:
an input to receive the sensor inputs associated with a temperature from the at least one computing device or the fluid, the one or more neural networks trained to infer a change in coolant state has occurred based in part on the temperature and on prior temperatures, the one or more circuits to cause the datacenter cooling system to operate in the first mode or the second mode.
21 . A processor comprising one or more circuits to cause a datacenter cooling system to operate in a first mode or a second mode, the datacenter cooling system comprising a fan wall and an associated liquid-to-air heat exchanger, the one or more circuits to comprise one or more neural networks to infer cooling requirements from sensor inputs of sensors associated with a rack or with a fluid from at least one cold plate, the first mode to address a first cooling requirement by air through the rack enabled by the fan wall and the second mode to address a second cooling requirement by the air through the liquid-to-air heat exchanger to cool the fluid circulating therein.
22 . The processor of claim 21 , further comprising:
an output to provide signals for one or more flow controllers to enable flow of the fluid through the liquid-to-air heat exchanger and to prevent flow of the fluid to a secondary cooling loop in the second mode of the datacenter cooling system.
23 . The processor of claim 21 , further comprising:
the one or more neural networks to receive the sensor inputs and to be trained to infer the first cooling requirement and the second cooling requirement as part of an analysis of prior sensor inputs and prior cooling requirements.
24 . The processor of claim 21 , further comprising:
an output to provide signals to cause one or more fans of the fan wall to be adjusted in the first mode differently than the second mode.
25 . The processor of claim 21 , further comprising:
an input to receive the sensor inputs associated with a temperature from the at least one computing device or the fluid, the one or more neural networks trained to infer a change in coolant state has occurred based in part on the temperature and on prior temperatures, the one or more circuits to cause the datacenter cooling system to operate in the first mode or the second mode.
26 . A method for datacenter cooling system, comprising:
providing a liquid-to-air heat exchanger associated with a fan wall of a rack; determining cooling requirements for at least one computing device of the rack; enabling the datacenter cooling system to address a first cooling requirement of the rack by air through the rack enabled by the fan wall with the liquid-to-air heat exchanger disabled; and enabling the datacenter cooling system to address a second cooling requirement of a fluid from at least one cold plate in the rack using the air through the liquid-to-air heat exchanger that is enabled to comprise the fluid circulating therein.
27 . The method of claim 26 , further comprising:
determining, using at least one processor, a temperature associated with a computing device in the rack; and determining the first cooling requirement or the second cooling requirement using the temperature.
28 . The method of claim 26 , further comprising:
receiving, in at least one processor, sensor inputs from sensors associated with the computing device, the rack, a secondary coolant, or the fluid; and determining, using the at least one processor, the first cooling requirement and the second cooling requirement based in part on the sensor inputs.
29 . The method of claim 26 , further comprising:
enabling, using a latching mechanism, the association of the liquid-to-air heat exchanger with the fan wall of the rack.
30 . The method of claim 26 , further comprising:
receiving, by at least one processor, sensor inputs from sensors associated with at least one computing device; determining, by the at least one processor, a change in a coolant state based in part on the sensor inputs; and causing, based in part on the change in the coolant state, the air to flow through the rack from the fan wall with the liquid-to-air heat exchanger disabled or the air to cause cooling associated with the liquid-to-air heat exchanger that is enabled to comprise the fluid circulating therein.Join the waitlist — get patent alerts
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