Electronic panel, tiling electronic device, and manufacturing method thereof

Abstract

A manufacturing method of a tiling electronic device includes the following steps. A first electronic panel is provided. The first electronic panel includes multiple first bumps and multiple first conducting lines, and the first bumps and the first conducting lines are disposed on a side surface of the first electronic panel. A second electronic panel is provided. The second electronic panel includes multiple second bumps and multiple second conducting lines, and the second bumps and the second conducting lines are disposed on a side surface of the second electronic panel. The first electronic panel and the second electronic panel are coupled through the first bumps and the second bumps. Multiple conducting elements are formed, so that the first conducting lines are electrically connected with the second conducting lines through the conducting elements after the first electronic panel and the second electronic panel are coupled.

What is claimed is: 
     
         1 . A manufacturing method of a tiling electronic device, comprising:
 providing a first electronic panel, wherein the first electronic panel comprises a plurality of first bumps and a plurality of first conducting lines, and the plurality of first bumps and the plurality of first conducting lines are disposed on a side surface of the first electronic panel;   providing a second electronic panel, wherein the second electronic panel comprises a plurality of second bumps and a plurality of second conducting lines, and the plurality of second bumps and the plurality of second conducting lines are disposed on a side surface of the second electronic panel;   coupling the first electronic panel and the second electronic panel through the plurality of first bumps and the plurality of second bumps; and   forming a plurality of conducting elements, so that the plurality of first conducting lines are electrically connected with the plurality of second conducting lines through the plurality of conducting elements after the first electronic panel and the second electronic panel are coupled.   
     
     
         2 . The manufacturing method according to  claim 1 , wherein forming the plurality of conducting elements is after coupling the first electronic panel and the second electronic panel. 
     
     
         3 . The manufacturing method according to  claim 2 , wherein forming the plurality of conducting elements comprises:
 filling a conducting liquid between the side surface of the first electronic panel and the side surface of the second electronic panel; and   applying a voltage to the plurality of first conducting lines and the plurality of second conducting lines, so that conducting particles in the conducting liquid are gathered between the plurality of first conducting lines and the plurality of second conducting lines.   
     
     
         4 . The manufacturing method according to  claim 1 , wherein forming the plurality of conducting elements is before coupling the first electronic panel and the second electronic panel. 
     
     
         5 . The manufacturing method according to  claim 4 , wherein forming the plurality of conducting elements comprises:
 respectively forming a plurality of first conducting elements on the plurality of first conducting lines; and   respectively forming a plurality of second conducting elements on the plurality of second conducting lines.   
     
     
         6 . The manufacturing method according to  claim 1 , wherein the plurality of first bumps and the plurality of second bumps couple the first electronic panel and the second electronic panel by magnetic force. 
     
     
         7 . The manufacturing method according to  claim 6 , wherein the plurality of first bumps and the plurality of second bumps couple the first electronic panel and the second electronic panel by a complementary bonding surface. 
     
     
         8 . An electronic panel, comprising:
 a substrate having a first surface and a side surface adjacent to the first surface;   a plurality of electronic elements disposed on the first surface;   a plurality of magnetic bumps disposed on the side surface; and   a plurality of conducting lines disposed on the side surface and electrically connected to the plurality of electronic elements.   
     
     
         9 . The electronic panel according to  claim 8 , wherein the plurality of magnetic bumps respectively have a three-dimensional bonding surface. 
     
     
         10 . The electronic panel according to  claim 8 , wherein the plurality of magnetic bumps comprise a plurality of first bumps having a concave surface and a plurality of first bumps having a convex surface, and the plurality of first bumps having the concave surface and the plurality of first bumps having the convex surface are alternately arranged with one another in an extending direction of the side surface. 
     
     
         11 . The electronic panel according to  claim 8 , further comprising a plurality of conducting elements disposed on the plurality of conducting lines. 
     
     
         12 . The electronic panel according to  claim 11 , wherein the plurality of magnetic bumps are respectively embedded in the plurality of conducting elements. 
     
     
         13 . The electronic panel according to  claim 11 , wherein one of the plurality of magnetic bumps and one of the plurality of conducting elements are in contact with each other. 
     
     
         14 . A tiling electronic device, comprising:
 a first electronic panel comprising a plurality of first magnetic bumps and a plurality of first conducting lines, wherein the plurality of first magnetic bumps and the plurality of first conducting lines are disposed on a side surface of the first electronic panel;   a second electronic panel comprising a plurality of second magnetic bumps and a plurality of second conducting lines, wherein the plurality of second magnetic bumps and the plurality of second conducting lines are disposed on a side surface of the second electronic panel adjacent to the first electronic panel; and   a plurality of conducting elements disposed between the first electronic panel and the second electronic panel;   wherein the plurality of first magnetic bumps and the corresponding plurality of second magnetic bumps are respectively attracted by one another, and the plurality of first conducting lines are electrically connected with the plurality of second conducting lines through the plurality of conducting elements.   
     
     
         15 . The tiling electronic device according to  claim 14 , wherein the plurality of first magnetic bumps and the corresponding plurality of second magnetic bumps respectively have a complementary bonding surface. 
     
     
         16 . The tiling electronic device according to  claim 14 , wherein the plurality of conducting elements comprise a plurality of first conducting elements disposed on the plurality of first conducting lines. 
     
     
         17 . The tiling electronic device according to  claim 16 , wherein the plurality of first magnetic bumps are respectively embedded in the plurality of first conducting elements. 
     
     
         18 . The tiling electronic device according to  claim 16 , wherein one of the plurality of first magnetic bumps and one of the plurality of first conducting elements are in contact with each other. 
     
     
         19 . The tiling electronic device according to  claim 16 , wherein the plurality of conducting elements further comprise a plurality of second conducting elements disposed on the plurality of second conducting lines. 
     
     
         20 . The tiling electronic device according to  claim 19 , wherein a height of the plurality of first conducting elements and the plurality of second conducting elements is greater than or equal to a height of the plurality of first magnetic bumps and the plurality of second magnetic bumps.