Packaged device carrier for thermal enhancement or signal redistribution of packaged semiconductor devices

Abstract

In a described example, an apparatus includes a packaged device carrier having a board side surface and an opposing surface, the packaged device carrier having conductive leads having a first thickness spaced from one another; the conductive leads having a head portion attached to a dielectric portion, a middle portion extending from the head portion and extending away from the board side surface of the packaged device carrier at an angle to the opposing surface, and each lead having an end extending from the middle portion with a foot portion configured for mounting to a substrate.

What is claimed is: 
     
         1 . A method, comprising:
 attaching conductive leads to a dielectric portion to form a packaged device carrier, the conductive leads having a head portion in the dielectric portion, a middle portion extending from the head portion and extending away from the dielectric portion, and an end portion extending from the middle portion and forming a foot portion for mounting to a system board; and   mounting a no-leads packaged semiconductor device to the packaged device carrier.   
     
     
         2 . The method of  claim 1 , wherein attaching conductive leads further comprises attaching C shaped conductive leads to the dielectric portion. 
     
     
         3 . The method of  claim 1 , wherein attaching conductive leads further comprises attaching leads having a straight middle portion. 
     
     
         4 . The method of  claim 1 , wherein attaching the conductive leads further comprises attaching S shaped leads to the dielectric. 
     
     
         5 . The method of  claim 1  wherein attaching the conductive leads further comprises attaching Z shaped leads to the dielectric. 
     
     
         6 . The method of  claim 1  wherein the no-leads packaged semiconductor device comprises a first no-leads packaged semiconductor device and further comprising attaching a second no-leads packaged semiconductor device to the packaged device carrier. 
     
     
         7 . The method of  claim 1  wherein mounting the no-leads packaged semiconductor device comprises mounting the packaged semiconductor device to a board side surface of the packaged device carrier. 
     
     
         8 . The method of  claim 1 , wherein mounting the no-leads packaged semiconductor device comprises mounting the packaged semiconductor device to surface of the packaged device carrier that is opposite a board side surface of the packaged device carrier.