Substrate processing apparatus, method of manufacturing semiconductor device, and non-transitory computer-readable recording medium

Abstract

There is provided a technique including a plurality of process chambers to process a substrate; a plurality of standby chambers to accommodate the substrate; a transfer chamber disposed adjacent to the plurality of standby chambers and the plurality of process chambers; a transfer robot in the transfer chamber to transfer the substrate between one of the plurality of process chambers and one of the plurality of standby chambers or between the plurality of standby chambers adjacent to each other across the transfer chamber; a temperature adjustment mechanism to adjust temperature of at least one of the plurality of standby chambers; and a controller capable of controlling the temperature adjustment mechanism to change a mode of temperature adjustment of the at least one of the plurality of standby chambers depending on a transfer path through which the substrate accommodated in the at least one of the plurality of standby chambers passes.

What is claimed is: 
     
         1 . A substrate processing apparatus comprising:
 a plurality of process chambers configured to process a substrate;   a plurality of standby chambers configured to accommodate the substrate;   a transfer chamber disposed adjacent to the plurality of standby chambers and the plurality of process chambers;   a transfer robot provided in the transfer chamber and configured to transfer a substrate between one of the plurality of process chambers and one of the plurality of standby chambers or between the plurality of standby chambers adjacent to each other across the transfer chamber;   a temperature adjustment mechanism configured to adjust temperature of at least one of the plurality of standby chambers; and   a controller configured to be capable of controlling the temperature adjustment mechanism so as to change a mode of temperature adjustment of the at least one of the plurality of standby chambers depending on a transfer path through which the substrate accommodated in the at least one of the plurality of standby chambers passes.   
     
     
         2 . The substrate processing apparatus according to  claim 1 , wherein
 the temperature adjustment mechanism includes a heating mechanism configured to heat the at least one of the plurality of standby chambers.   
     
     
         3 . The substrate processing apparatus according to  claim 1 , wherein
 the temperature adjustment mechanism includes a cooling mechanism configured to cool the at least one of the plurality of standby chambers.   
     
     
         4 . The substrate processing apparatus according to  claim 1 , wherein
 the controller controls the temperature adjustment mechanism such that unprocessed substrates to be processed in the plurality of process chambers are loaded into the plurality of process chambers simultaneously at a same temperature.   
     
     
         5 . The substrate processing apparatus according to  claim 1 , wherein
 the controller controls the temperature adjustment mechanism such that a plurality of processed substrates unloaded from the plurality of process chambers and loaded into one of the plurality of standby chambers are unloaded from the one of the standby chambers at a same temperature.   
     
     
         6 . A method of manufacturing a semiconductor device, the method comprising:
 by using a substrate processing apparatus including   a plurality of process chambers configured to process a substrate,   a plurality of standby chambers configured to accommodate the substrate,   a transfer chamber disposed adjacent to the plurality of standby chambers and the plurality of process chambers,   a transfer robot provided in the transfer chamber and configured to transfer a substrate, and   a temperature adjustment mechanism configured to adjust temperature of at least one of the plurality of standby chambers,   transferring the substrate between one of the plurality of process chambers and one of the plurality of standby chambers or between the plurality of standby chambers adjacent to each other across the transfer chamber by the transfer robot; and   performing processing of changing a mode of temperature adjustment on the substrate loaded into the at least one of the plurality of standby chambers depending on a transfer path through which the substrate accommodated in the at least one of the plurality of standby chambers passes.   
     
     
         7 . The method according to  claim 6 , wherein
 the temperature adjustment mechanism includes a heating mechanism configured to heat the at least one of the plurality of standby chambers, and, in performing the processing, performs processing of heating the substrate transferred to the at least one of the standby chambers.   
     
     
         8 . The method according to  claim 6 , wherein
 the temperature adjustment mechanism includes a cooling mechanism configured to cool the at least one of the plurality of standby chambers, and, in performing the processing, performs processing of cooling the substrate transferred to the at least one of the plurality of standby chambers.   
     
     
         9 . The method according to  claim 6 , further comprising:
 loading a plurality of unprocessed substrates to be processed in the plurality of process chambers into the plurality of process chambers simultaneously at a same temperature before performing processing of the plurality of unprocessed substrates in the plurality of process chambers.   
     
     
         10 . The method according to  claim 6 , further comprising:
 after processing a plurality of substrates in the plurality of process chambers, unloading the plurality of processed substrates unloaded from the plurality of process chambers and loaded into one of the plurality of standby chambers out from the one of the plurality of standby chambers at a same temperature.   
     
     
         11 . A non-transitory computer-readable recording medium storing a program that causes, by a computer, a substrate processing apparatus to perform a process, the substrate processing apparatus including
 a plurality of process chambers configured to process a substrate,   a plurality of standby chambers configured to accommodate the substrate,   a transfer chamber disposed adjacent to the plurality of standby chambers and the plurality of process chambers,   a transfer robot provided in the transfer chamber and configured to transfer the substrate, and   a temperature adjustment mechanism configured to adjust temperature of at least one of the plurality of standby chambers,   the process comprising:   transferring the substrate between one of the plurality of process chambers and one of the plurality of standby chambers or between the plurality of standby chambers adjacent to each other across the transfer chamber by the transfer robot; and   performing processing of changing a mode of temperature adjustment on the substrate loaded into the at least one of the plurality of standby chambers depending on a transfer path through which the substrate accommodated in the at least one of the plurality of standby chambers passes.   
     
     
         12 . The non-transitory computer-readable recording medium according to  claim 11 , wherein
 the temperature adjustment mechanism is a heating mechanism configured to heat the at least one of the plurality of standby chambers, and   in performing the processing, processing of heating the substrate transferred to the at least one of the plurality of standby chambers is performed.   
     
     
         13 . The non-transitory computer-readable recording medium according to  claim 11 , wherein
 the temperature adjustment mechanism is a cooling mechanism configured to cool the at least one of the plurality of standby chambers, and   in performing the processing, processing of cooling the substrate transferred to the at least one of the plurality of standby chambers is performed.   
     
     
         14 . The non-transitory computer-readable recording medium according to  claim 11 , the process further comprising:
 loading unprocessed substrates to be processed in the plurality of process chambers into the plurality of process chambers simultaneously at a same temperature before performing the processing.   
     
     
         15 . The non-transitory computer-readable recording medium according to  claim 11 , the process further comprising:
 unloading a plurality of processed substrates unloaded from the plurality of process chambers and loaded into one of the plurality of standby chambers out from the one of the plurality of standby chambers at a same temperature after performing the processing.