Colored photosensitive resin composition and multilayer cured film prepared therefrom

Abstract

The colored photosensitive resin composition of the present invention maintains excellent resolution, visibility, and the like while it has excellent reflectance RSCI measured by the SCI (specular component included) method, reflectance RSCE measured by the SCE (specular component excluded) method, and the ratio between them (RSCE/RSCI), and has a uniform film thickness in an appropriate range. Thus, it can be formed into a multilayer cured film that simultaneously satisfies such physical properties as a high reflectance and a high light-shielding property. In addition, when a cured film is formed from the composition, it is possible to form a pattern on a multilayer film in a single development process. Thus, it can be advantageously used for a quantum dot display device.

1 . A colored photosensitive resin composition, which comprises:
 (A) a copolymer;   (B) a photopolymerizable compound;   (C) a photopolymerization initiator; and   (D) a pigment,   wherein when the copolymer (A) comprises a first copolymer (A1), the pigment (D) comprises a white pigment (D1),   when the copolymer (A) comprises a second copolymer (A2), the pigment (D) comprises a pigment other than white (D2),   the first copolymer (A1) comprises (a1) a structural unit derived from an ethylenically unsaturated carboxylic acid, an ethylenically unsaturated carboxylic anhydride, or a combination thereof; (a2) a structural unit derived from an ethylenically unsaturated compound containing an aromatic ring; (a3) a structural unit derived from an ethylenically unsaturated compound containing an epoxy group; and (a4) a structural unit derived from an ethylenically unsaturated compound different from (a1) to (a3), and   the second copolymer (A2) comprises (b1) a structural unit derived from an ethylenically unsaturated carboxylic acid, an ethylenically unsaturated carboxylic anhydride, or a combination thereof, and (b2) a structural unit derived from an ethylenically unsaturated compound containing an epoxy group, and comprises at least one of (b3) a structural unit derived from an ethylenically unsaturated compound containing fluorine; and (b4) a structural unit derived from an ethylenically unsaturated compound different from (b1) to (b3).   
     
     
         2 . The colored photosensitive resin composition of  claim 1 , wherein the white pigment (D1) is at least one selected from the group consisting of titanium oxide (TiO 2 ), zirconium oxide (ZrO 2 ), zinc oxide (ZnO), and silicon dioxide (SiO 2 ). 
     
     
         3 . The colored photosensitive resin composition of  claim 1 , wherein the white pigment (D1) is employed in an amount of 20 to 65 parts by weight relative to 100 parts by weight of the first copolymer (A1) (on the basis of the solids content). 
     
     
         4 . The colored photosensitive resin composition of  claim 1 , wherein the white pigment (D1) has a particle diameter of 120 nm to 400 nm. 
     
     
         5 . The colored photosensitive resin composition of  claim 1 , wherein the pigment other than white (D2) is at least one selected from the group consisting of a yellow pigment, a violet pigment, a red pigment, an orange pigment, a blue pigment, and a black pigment. 
     
     
         6 . The colored photosensitive resin composition of  claim 1 , wherein the pigment other than white (D2) is employed in an amount of 3 to 30 parts by weight relative to 100 parts by weight of the second copolymer (A2) (on the basis of the solids content). 
     
     
         7 . The colored photosensitive resin composition of  claim 1 , wherein the pigment other than white (D2) has a particle diameter of 50 nm to 200 nm. 
     
     
         8 . The colored photosensitive resin composition of  claim 1 , which further comprises at least one additive selected from the group consisting of an epoxy compound, a photobase generator, a thiol-based compound, a compound derived from an epoxy resin, and an adhesion supplement. 
     
     
         9 . A multilayer cured film, which comprises a first cured film formed from a first colored photosensitive resin composition and a second cured film formed from a second colored photosensitive resin composition,
 wherein the first colored photosensitive resin composition comprises (A1) a first copolymer; (B) a photopolymerizable compound; (C) a photopolymerization initiator; and (D1) a white pigment,   the second colored photosensitive resin composition comprises (A2) a second copolymer; (B) a photopolymerizable compound; (C) a photopolymerization initiator; and (D2) a pigment other than white, and   the multilayer cured film has a total thickness of 6 μm or more.   
     
     
         10 . The multilayer cured film of  claim 9 , wherein the reflectance R SCI  measured by the SCI (specular component included) method and the reflectance R SCE  measured by the SCE (specular component excluded) method for the multilayer cured film satisfy the following relationships, respectively:
   50%≤ R   SCI   (Relationship 1)
     40%≤ R   SCE   (Relationship 2)
     50%≤ R   SCE   /R   SCI .  (Relationship 3)
   
     
     
         11 . The multilayer cured film of  claim 9 , wherein the first cured film and the second cured film have a thickness of 10 μm or less, respectively. 
     
     
         12 . The multilayer cured film of  claim 11 , wherein the second cured film is composed of multiple layers. 
     
     
         13 . The multilayer cured film of  claim 12 , wherein the second cured film is composed of 2 to 10 layers. 
     
     
         14 . The multilayer cured film of  claim 9 , wherein the multilayer cured film has a total thickness of 6 μm to 20 μm. 
     
     
         15 . The multilayer cured film of  claim 9 , wherein the multilayer cured film is used as a structure of quantum dot barrier ribs. 
     
     
         16 . A process for preparing a multilayer cured film, which comprises:
 (1) coating a first colored photosensitive resin composition on a substrate and curing it to form a first cured film;   (2) coating a second colored photosensitive resin composition on the first cured film and curing it to form a second cured film; and   (3) exposing and developing it to form a pattern and then post-baking it,   wherein the first colored photosensitive resin composition comprises (A1) a first copolymer; (B) a photopolymerizable compound; (C) a photopolymerization initiator; and (D1) a white pigment,   the second colored photosensitive resin composition comprises (A2) a second copolymer; (B) a photopolymerizable compound; (C) a photopolymerization initiator; and (D2) a pigment other than white, and   the multilayer cured film has a total thickness of 6 μm or more.   
     
     
         17 . The process for preparing a multilayer cured film of  claim 16 , wherein in steps (1) and (2), the curing is carried out at 70 to 140° C. for 50 to 900 seconds. 
     
     
         18 . The process for preparing a multilayer cured film of  claim 17 , wherein the curing comprises pre-bake at 70 to 100° C. for 50 to 400 seconds; and mid-bake at 80 to 140° C. for 100 to 500 seconds. 
     
     
         19 . The process for preparing a multilayer cured film of  claim 16 , wherein the post-bake in step (3) is carried out at 150 to 300° C. for 10 to 60 minutes.