Integrated circuit package and system using same

Abstract

Various embodiments of an integrated circuit package and a method of forming such package are disclosed. The integrated circuit package includes first and second active dies. Each of the first and second active dies includes a top contact disposed on the top surface of the die and a bottom contact disposed on a bottom surface of the die. The package further includes a via die having first and second vias that each extends between a top contact disposed on a top surface of the via die and a bottom contact disposed on a bottom surface of the via die, where the bottom contact of the first active die is electrically connected to the bottom contact of the first via of the via die and the bottom contact of the second active die is electrically connected to the bottom contact of the second via of the via die.

What is claimed is: 
     
         1 . An integrated circuit package, comprising:
 first and second active dies, wherein the first active die is adapted to emit electromagnetic radiation from a top surface that comprises a first wavelength and the second active die is adapted to emit electromagnetic radiation from a top surface that comprises a second wavelength different from the first wavelength, wherein each of the first and second active dies comprises a top contact disposed on the top surface of the die and a bottom contact disposed on a bottom surface of the die; and   a via die comprising first and second vias that each extends between a top contact disposed on a top surface of the via die and a bottom contact disposed on a bottom surface of the via die, wherein the bottom contact of the first active die is electrically connected to the bottom contact of the first via of the via die and the bottom contact of the second active die is electrically connected to the bottom contact of the second via of the via die.   
     
     
         2 . The package of  claim 1 , further comprising third, fourth, and fifth active dies, wherein the third active die is adapted to emit electromagnetic radiation from a top surface that comprises a third wavelength, the fourth active die is adapted to emit electromagnetic radiation from a top surface that comprises a fourth wavelength, and the fifth active die is adapted to emit electromagnetic radiation from a top surface of the fifth active die that comprises a fifth wavelength;
 wherein the bottom contact of each of the third, fourth, and fifth active dies is electrically connected to bottom contacts of third, fourth, and fifth vias respectively of the via die.   
     
     
         3 . The package of  claim 1 , wherein the first and second active dies and the via die are disposed in a molded encapsulant. 
     
     
         4 . The package of  claim 3 , wherein the encapsulant is disposed between the first and second active dies and the via die. 
     
     
         5 . The package of  claim 1 , further comprising a patterned conductive layer disposed on the bottom surfaces of the first and second active dies and the via die, wherein the patterned conductive layer electrically connects the bottom contact of the first active die to the bottom contact of the first via of the via die and the bottom contact of the second active die to the bottom contact of the second via of the via die. 
     
     
         6 . The package of  claim 1 , further comprising solder bumps disposed on the top contact of each of the first and second active dies and the via die. 
     
     
         7 . The package of  claim 1 , wherein at least one of the first and second active dies comprises a light emitting diode. 
     
     
         8 . The package of  claim 1 , wherein at least one of the first and second active dies comprises a vertical-cavity surface-emitting laser. 
     
     
         9 . The package of  claim 1 , wherein at least one of the first and second active dies comprises an organic light emitting diode. 
     
     
         10 . The package of  claim 1 , wherein each of the first and second active dies comprises an aperture disposed on the top surface of the die, wherein the electromagnetic radiation emitted by each of the first and second active dies is directed through the respective aperture. 
     
     
         11 . The package of  claim 1 , wherein a bandwidth of the electromagnetic radiation emitted by each of the first and second active dies is no greater than 20 nm full-width at half-maximum. 
     
     
         12 . The package of  claim 1 , wherein at least one of the first and second active dies may be pulsed in a sequential manner. 
     
     
         13 . The package of  claim 1 , wherein at least one of the first or second dies comprises a cone angle of emission of no greater than 90 degrees. 
     
     
         14 . The package of  claim 1 , wherein the first active die comprises a second top contact and a second bottom contact, and further wherein the second active die comprises a second top contact and a second bottom contact. 
     
     
         15 . The package of  claim 14 , wherein the second top contact of the first active die is electrically connected to the second top contact of the second active die. 
     
     
         16 . The package of  claim 14 , wherein the second bottom contact of the first active die is electrically connected to the second bottom contact of the second active die. 
     
     
         17 . The package of  claim 1 , wherein each of the first and second active dies comprises a broadband emitter that utilizes re-emission of phosphorous materials. 
     
     
         18 . The package of  claim 1 , wherein the first and second active dies and the via die are disposed on a substrate. 
     
     
         19 . The package of  claim 1 , wherein at least one of the first active die and the second active die can emit at least one of infrared, near-infrared, visible, and UV light. 
     
     
         20 . An implantable medical device comprising the integrated circuit package of  claim 1 .