Power module and manufacturing method thereof

Abstract

A power module and a manufacturing method thereof are disclosed. The power module includes a magnetic component, a bare power chip and a conductive set. The magnetic component includes a first surface and a second surface opposite to each other. The bare power chip is disposed on the magnetic component and includes a third surface and a fourth surface opposite to each other. The conductive set is disposed on the magnetic component and electrically connected with the magnetic component and the bare power chip. The third or fourth surface of the bare power chip is at least partially attached on the first or second surface of the magnetic component, and at least partially included in a projected envelopment of the corresponding first or second surface of the magnetic component, so as to facilitate the magnetic component to support the bare power chip.

What is claimed is: 
     
         1 . A manufacturing method of a power module, comprising steps of:
 (a) providing plural magnetic components, wherein each of the plural magnetic components comprises a first surface and a second surface and the first surface is opposite to the second surface;   (b) forming at least one insulation layer around the plural magnetic components to conjoin the plural magnetic components into a connection panel, wherein the first surfaces of the plural magnetic components are coplanar or the second surfaces of the plural magnetic components are coplanar;   (c) providing plural bare power chips disposed correspondingly on the plural magnetic components, wherein each of the plural bare power chips comprises a third surface and a fourth surface and the third surface is opposite to the fourth surface, wherein one of the third surface and the fourth surface of the bare power chip is at least partially attached on one of the first surface and the second surface of the corresponding magnetic component, and one of the third surface and the fourth surface of the bare power chip is at least partially included in a projected envelopment of the corresponding one of the first surface and the second surface of the corresponding magnetic component, so as to facilitate the corresponding magnetic component to support the bare power chip;   (d) forming at least one second insulation layer to cover the plural bare power chips;   (e) forming plural conductive sets disposed on the at least one second insulation layer, wherein the plural conductive sets are electrically connected with the plural bare power chips and the plural magnetic components; and   (f) dividing the at least one first insulation layer and the at least one second insulation layer to obtain plural power modules.   
     
     
         2 . The manufacturing method of the power module according to  claim 1 , wherein the power module comprises an adhesion layer and the bare power chip is attached to the corresponding magnetic component through the adhesion layer at the step (c). 
     
     
         3 . The manufacturing method of the power module according to  claim 1 , wherein the step (a) further comprises a step of (a0) providing an auxiliary film to carry and arrange the plural magnetic components thereon. 
     
     
         4 . The manufacturing method of the power module according to  claim 1 , wherein the step (a) further comprises a step of (a1) providing an auxiliary film to carry and arrange the plural magnetic components thereon, wherein the first surfaces of the plural magnetic components are coplanar and attached to the auxiliary film or the second surfaces of the plural magnetic components are coplanar and attached to the auxiliary film, wherein the step (b) further comprises a step of (b1) removing the auxiliary film after conjoining the plural magnetic components and the at least one first insulation layer into the connection panel. 
     
     
         5 . The manufacturing method of the power module according to  claim 4 , wherein the auxiliary film is arranged under the plural magnetic components at the step (a1), wherein the step (b) further comprises a step (b2) of turning over the connection panel. 
     
     
         6 . The manufacturing method of the power module according to  claim 5 , wherein the step (a) further comprises a step of (a2) providing at least one component arranged on the auxiliary film, wherein a surface of the at least one component and the first surfaces of the plural magnetic components are coplanar or the surface of the at least one component and the second surfaces of the plural magnetic components are coplanar. 
     
     
         7 . The manufacturing method of the power module according to  claim 1 , wherein the at least one conductive set comprises at least one conductive via and at least one metallization layer, the at least one metallization layer is disposed on the second insulation layer, and the at least one metallization layer is connected to one of the bare power chip and the magnetic component through the at least one conductive via. 
     
     
         8 . The manufacturing method of the power module according to  claim 1 , wherein the conductive set comprises at least one first metallization layer, and the step (e) further comprises steps of (e1) forming a third insulation layer disposed on the second insulation layer; and (e2) forming at least one second metallization layer disposed on the third insulation layer, wherein the at least one first metallization layer and the at least one second metallization layer are electrically connected with each other, wherein the at bare power chip and the corresponding magnetic component are electrically connected with each other through the at least one first metallization layer. 
     
     
         9 . A manufacturing method of a power module, comprising steps of:
 (a) providing an auxiliary film and plural magnetic components and arranging the plural magnetic components on the auxiliary film to form a connection panel, wherein each of the plural magnetic components comprises a first surface and a second surface and the first surface is opposite to the second surface, wherein the second surfaces of the plural magnetic components are attached on the auxiliary film;   (b) providing plural bare power chips disposed correspondingly on the plural magnetic components, wherein each of the plural bare power chips comprises a third surface and a fourth surface and the third surface is opposite to the fourth surface, wherein one of the third surface and the fourth surface of the bare power chip is at least partially attached on one of the first surface and the second surface of the corresponding magnetic component, and one of the third surface and the fourth surface of the bare power chip is at least partially included in a projected envelopment of the corresponding one of the first surface and the second surface of the corresponding magnetic component, so as to facilitate the corresponding magnetic component to support the bare power chip;   (c) forming at least one first insulation layer to cover the plural magnetic components and the plural bare power chips;   (d) forming plural conductive sets disposed on the at least one first insulation layer, wherein the plural conductive sets are spatially corresponding to and electrically connected with the plural bare power chips and the plural magnetic components; and   (e) dividing the at least one first insulation layer and removing the auxiliary film to obtain plural power modules.   
     
     
         10 . The manufacturing method of the power module according to  claim 9 , wherein the power module comprises an adhesion layer and the bare power chip is attached to the corresponding magnetic component through the adhesion layer at the step (b). 
     
     
         11 . A power module comprising:
 at least one magnetic component comprising a main body, at least one winding set, a first surface and a second surface, wherein the at least winding set winds on the main body, and the first surface is opposite to the second surface;   at least one bare power chip disposed on the at least one magnetic component and comprising a third surface and a fourth surface, wherein the third surface is opposite to the fourth surface;   at least one first connection component electrically connected with the at least one bare power chip; and   at least one second connection component electrically connected with the at least magnetic component, wherein the first connection component connected with the at least one bare power chip has a height less than a height of the second connection component connected with the at least one magnetic component;   wherein one of the third surface and the fourth surface of the at least one bare power chip is at least partially attached on one of the first surface and the second surface of the at least one magnetic component, and one of the third surface and the fourth surface of the at least one bare power chip is at least partially included in a projected envelopment of the corresponding one of the first surface and the second surface of the at least one magnetic component, so as to facilitate the at least one magnetic component to support the at least one bare power chip.   
     
     
         12 . A manufacturing method of a power module, comprising steps of:
 (a) providing an auxiliary film and plural magnetic components and arranging the plural magnetic components on the auxiliary film to form a connection panel, wherein each of the plural magnetic components comprises a first surface and a second surface and the first surface is opposite to the second surface, wherein the second surfaces of the plural magnetic components are attached on the auxiliary film;   (b) providing plural bare power chips disposed correspondingly on the plural magnetic components, wherein each of the plural bare power chips comprises a third surface and a fourth surface and the third surface is opposite to the fourth surface, wherein one of the third surface and the fourth surface of the bare power chip is at least partially attached on one of the first surface and the second surface of the corresponding magnetic component, and one of the third surface and the fourth surface of the bare power chip is at least partially included in a projected envelopment of the corresponding one of the first surface and the second surface of the corresponding magnetic component, so as to facilitate the corresponding magnetic component to support the bare power chip;   (c) providing plural connection components spatially corresponding to and electrically connected with the plural bare power chips and the plural magnetic components, respectively; and   (d) removing the auxiliary film to obtain plural power modules.