Method of manufacturing an electromagnetic wave shielding film comprising an electromagnetic wave shielding layer

Abstract

Provided is a method for manufacturing an electromagnetic interference shielding film comprising an electromagnetic interference shielding layer, the method comprising the steps of: preparing a metal nanoplate solution comprising a solvent in which metal nanoplates are dispersed; and coating the metal nanoplate solution on a substrate.

What is claimed is: 
     
         1 . A method of manufacturing an electromagnetic wave shielding film comprising an electromagnetic wave shielding layer, the method comprising the steps of:
 preparing a metal nanoplate solution containing a solvent in which a metal nanoplate is dispersed; and   coating the metal nanoplate solution on a substrate.   
     
     
         2 . The method according to  claim 1 , wherein the metal nanoplate solution comprises 0.01 to 80 parts by weight of the metal nanoplate with respect to 100 parts by weight of the solvent. 
     
     
         3 . The method according to  claim 1 , further comprising the step of:
 performing a heat treatment process or a reduction process on the substrate coated with the metal nanoplate solution to manufacture an electromagnetic wave shielding layer.   
     
     
         4 . The method according to  claim 1 , further comprising the step of:
 forming a surface protective layer on the electromagnetic wave shielding layer.   
     
     
         5 . The method according to  claim 1 , wherein the coating step comprises coating the metal nanoplate on the substrate with a loading amount of 0.2-100 mg/cm 2 . 
     
     
         6 . The method according to  claim 1 , wherein the metal nanoplate solution is coated 2 to 10 times, 1 ml each, during the coating process. 
     
     
         7 . The method according to  claim 1 ,
 wherein the metal nanoplate is annealed by performing a heat treatment process on the substrate coated with the metal nanoplate solution, and   wherein the heat treatment process is performed under a temperature condition of 100 to 250° C.   
     
     
         8 . The method according to  claim 7 ,
 wherein the metal nanoplate is annealed by performing a reduction process on the substrate coated with the metal nanoparticle solution, and   wherein the reduction process is a chemical reduction process or an optical reduction process.   
     
     
         9 . The method according to  claim 1 , wherein the electromagnetic wave shielding layer has a thickness in the range of 50 nm to 500 μm. 
     
     
         10 . A method of manufacturing an electromagnetic wave shielding film comprising an electromagnetic wave shielding layer, the method comprising the steps of:
 performing a heat treatment process on the metal nanoplate;   preparing a metal nanoplate solution comprising the heat-treated metal nanoplate, the polymer resin, and the solvent after the heat treatment process;   subjecting the metal nanoplate solution to sonic treatment to produce a preliminary polymer resin-metal nanoplate composite; and   drying the preliminary polymer-resin nanoplate composite to manufacture an electromagnetic wave shielding layer comprising the polymer resin-metal nanoplate composite.   
     
     
         11 . The method according to  claim 10 , wherein 0.01 to 80 parts by weight of the polymer resin and 0.01 to 80 parts by weight of a metal nanoplate with respect to 100 parts by weight of the solvent are contained in the metal nanoplate solution. 
     
     
         12 . The method according to  claim 10 , wherein the metal nanoplate is annealed through the heat treatment process, and the heat treatment process is performed under a temperature condition of 100 to 250° C. 
     
     
         13 . The method according to  claim 10 , wherein the drying process comprises:
 a first drying process performed under a temperature condition of 15 to 30° C.; and   a second drying process performed under a temperature condition of 40 to 60° C.   
     
     
         14 . The method according to  claim 10 , further comprising the step of:
 forming a surface protective layer on the electromagnetic wave shielding layer after manufacturing the electromagnetic wave shielding layer.