US2022137805A1PendingUtilityA1
Systems and methods for determining liquid cooled architectures in an it room
Est. expiryMar 31, 2040(~13.7 yrs left)· nominal 20-yr term from priority
H05K 7/20709G06F 30/12G06F 30/13H05K 7/20836G06F 3/04847H05K 7/20236G06F 3/0482H05K 7/20781
64
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Claims
Abstract
Methods and systems for designing a liquid cooled IT room architecture for an IT room include receiving a design parameter, responsive to a user input, corresponding to at least one equipment rack in the IT room, determining a dielectric fluid return temperature T h in in the architecture based on an energy balance equation and a heat exchange equation, and responsive to receiving the design parameter and determining the dielectric fluid return temperature, dynamically calculating and displaying at least one of a surface temperature of at least one immersion-cooled equipment rack cooled by the architecture or an amount of required room cooling power per a unit of area of the IT room.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A system for designing a liquid cooled IT room architecture for an IT room, the system comprising:
at least one processor configured to:
receive a design parameter, responsive to a user input, corresponding to at least one equipment rack in the IT room;
determine a dielectric fluid return temperature T h in in the architecture based on an energy balance equation and a heat exchange equation; and
responsive to receiving the design parameter and determining the dielectric fluid return temperature, dynamically calculate and display at least one of a surface temperature of at least one immersion-cooled equipment rack cooled by the architecture or an amount of required room cooling power per a unit of area of the IT room.
2 . The system of claim 1 , wherein dynamically calculating comprises dynamically calculating a percentage of total heat load removed by liquid cooling in the architecture and/or air cooling in the architecture.
3 . The system of claim 1 , wherein dynamically calculating comprises dynamically calculating a percentage of total heat load produced by the at least one immersion-cooled rack, at least one direct-to-chip-cooled rack, at least one air-cooled rack, or piping in the architecture.
4 . The system of claim 1 , wherein the dielectric fluid return temperature T h in is determined by calculating an overall thermal resistance R amb between the ambient environment and external skin of the at least one immersion-cooled equipment rack.
5 . The system of claim 4 ,
R
amb
=
N
s
a
R
amb
s
a
+
N
m
R
a
m
b
m
+
N
e
R
amb
e
N
s
a
+
N
m
+
N
e
wherein where N sa is a number of stand alone racks, N m is a number of middle racks, N e is a number of end racks, R amb sa is a thermal resistance of the stand alone racks, R amb m is a thermal resistance of the middle racks, and R amb e is a thermal resistance of the end racks.
6 . The system of claim 4 , wherein R amb =αe −βΔT γ where ΔT=|T h in −T amb |, T amb is an ambient room temperature, and α, β, and γ are previously-computed constants calculated over a range of thermal emissivity ε and ambient temperature T amb values.
7 . The system of claim 1 , wherein the dielectric fluid return temperature is determined by retrieving a plurality of constants from one or more stored tables of simulation data generated from a plurality of previously completed computational fluid dynamics simulations.
8 . The system of claim 7 , wherein the one or more stored tables include one table for stand-alone racks, one table for middle racks, or one table for end racks.
9 . The system of claim 1 , wherein the at least one processor is further configured to solve the energy balance equation and the heat exchange equation for two unknowns including the dielectric fluid return temperature T h in where h denotes a hot stream.
10 . The system of claim 9 wherein in solving the energy balance equation and the heat exchange equation, a temperature of external skin of the at least one immersion-cooled equipment rack is equivalent to the dielectric fluid return temperature T h in .
11 . A non-transitory computer-readable medium storing instructions that, when executed by one or more processors, cause the one or more processors to perform the steps comprising:
receiving a design parameter, responsive to a user input, corresponding to at least one equipment rack in the IT room; determining a dielectric fluid return temperature T h in in the architecture based on an energy balance equation and a heat exchange equation; and responsive to receiving the design parameter and determining the dielectric fluid return temperature, dynamically calculating and displaying at least one of a surface temperature of at least one immersion-cooled equipment rack cooled by the architecture or an amount of required room cooling power per a unit of area of the IT room.
12 . The non-transitory computer-readable medium of claim 11 , wherein dynamically calculating comprises dynamically calculating a percentage of total heat load removed by liquid cooling in the architecture and/or air cooling in the architecture.
13 . The non-transitory computer-readable medium of claim 11 , wherein dynamically calculating comprises dynamically calculating a percentage of total heat load produced by the at least one immersion-cooled rack, at least one direct-to-chip-cooled rack, at least one air-cooled rack, or piping in the architecture.
14 . The non-transitory computer-readable medium of claim 11 , wherein the dielectric fluid return temperature T h in is determined by calculating an overall thermal resistance R amb between the ambient environment and external skin of the at least one immersion-cooled equipment rack.
15 . The non-transitory computer-readable medium of claim 14 , wherein
R
amb
=
N
s
a
R
amb
s
a
+
N
m
R
a
m
b
m
+
N
e
R
amb
e
N
s
a
+
N
m
+
N
e
where N sa is a number of stand alone racks, N m is a number of middle racks, N e is a number of end racks, R amb sa is a thermal resistance of the stand alone racks, R amb m is a thermal resistance of the middle racks, and R amb e is a thermal resistance of the end racks.
16 . The non-transitory computer-readable medium of claim 14 , wherein R amb =αe −βΔT γ where ΔT=|T h in −T amb |, T amb is an ambient room temperature, and α, β, and γ are previously-computed constants calculated over a range of thermal emissivity ε and ambient temperature T amb values.
17 . The non-transitory computer-readable medium of claim 11 , wherein the dielectric fluid return temperature is determined by retrieving a plurality of constants from one or more stored tables of simulation data generated from a plurality of previously completed computational fluid dynamics simulations.
18 . The non-transitory computer-readable medium of claim 17 , wherein the one or more stored tables include one table for stand-alone racks, one table for middle racks, or one table for end racks.
19 . The non-transitory computer-readable medium of claim 11 , wherein the steps further comprise solving the energy balance equation and the heat exchange equation for two unknowns including the dielectric fluid return temperature T h in where h denotes a hot stream.
20 . The non-transitory computer-readable medium of claim 19 wherein in solving the energy balance equation and the heat exchange equation, a temperature of external skin of the at least one immersion-cooled equipment rack is equivalent to the dielectric fluid return temperature T h in .Join the waitlist — get patent alerts
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